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[XTOM-MATRIX Series] High-Precision Blue Light 3D Scanning System

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[XTDIC-SPARK Series] 3D high-speed measurement system

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[XTDIC-STROBE Series] 3D dynamic measurement system

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[XTDIC-MICRO Series] 3D microstrain measurement system

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[XTDIC] 3D full-field strain measurement and analysis software

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Exploring Micro-Forces: XTOP3D Highlights Micro-DIC 3D Strain Measurement at the 3rd Micro-Mechanical Testing Seminar

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XTOP3D Launches XTOM-MATRIX-12M Micron-Level Precision Blue Light 3D Scanner

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XTOP3D Launches Flagship XTOM-STATION Automated 3D Inspection Center

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Media Focus | XTOP3D Empowers Automated 3D Inspection with Dual Flagship 3D Scanning Systems

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High-Speed DIC Technology: Capturing Transient Deformation in Explosion Mechanics

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Evaluation of Material Dynamic Mechanical Properties using 3D DIC System in Split Hopkinson Tension Bar Testing

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Key Applications and Technical Advantages of Non-Contact 3D DIC Strain Measurement Systems

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XTOM-MATRIX 3D Scanner: High-Precision Measurement for Complex Surfaces and Flexible Workpieces

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XTOP3D Showcases XTDIC 3D Full-Field Strain Measurement System at Seismic Mitigation Engineering Conference

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Utilizing DIC Technology for Chip Thermal Deformation and Strain Measurement at High-Low Temperatures

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XTOP3D Showcases XTDIC 3D Optical Strain Measurement System at the 2nd Civil Engineering New Materials and Structures Conference

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XTOP3D Showcases 3D DIC Measurement Technology for Advanced Materials Industry at SAMPE China

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XTOP3D Empowers Dynamic Multi-Disaster Structural Protection with Advanced 3D DIC Strain Measurement Technology

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XTOP3D Showcases 3D DIC Strain and Dynamic Measurement Systems at National Explosion Mechanics Conference

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Invitation: XTOP 3D to Exhibit DIC & 3D Scanning Solutions at CCTAM 2021

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Monocular High-Speed DIC Technology for Micrometer-Level High-Frequency Vibration Capture

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How DIC Technology Analyzes PCB Thermal Warpage and Deformation

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Metal Fatigue Testing with XTDIC-VG Video Extensometer: Non-Contact Strain Measurement Case Study

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DIC Technology for Seismic Damage Analysis in Prefabricated Frame Joints

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DIC for Small-Scale Compressive Deformation Monitoring in Materials

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DIC for Railway Track Deformation Under Dynamic Loads

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DIC for Concrete Wall Deformation Monitoring and Analysis

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XTOM-12M Blue Light 3D Scanner for Precision Manufacturing

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DIC 3D Dynamic Deformation Measurement for Automotive Wind Tunnel Tests

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XTOM-MATRIX 12M: Micron-Level Precision Blue Light 3D Scanner

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3D Micro Strain Measurement for Electronic Component Thermal Testing

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High-Speed DIC for Large-Scale Shaking Table Displacement Measurement

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DIC 3D Strain Measurement for Wafer Thermal Deformation Analysis

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Micro-DIC for Pasta Bending Deformation Analysis at Micro Scale

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DIC Technology for Explosive Powder Flowability and Pressing Deformation Analysis

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XTOM Blue Light 3D Scanner for Micro-Scale Additive Manufacturing Inspection

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High-Speed DIC for Electronics Drop and Shock Testing

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DIC for High-Temperature Material Testing and Quality Analysis

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High-Speed DIC for 3C and Mobile Phone Drop Testing

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3D-DIC for Automobile Axle Dynamic Deformation and Strain Analysis

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3D-DIC for Crane Boom Deflection and Displacement Measurement

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DIC for Earthquake Simulation and Civil Structure Vibration Analysis

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3D DIC for Aircraft Wing Dynamic Deformation Measurement

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3D DIC for Aircraft 6-DOF Space Attitude Dynamic Tracking

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XTOM Small Format 3D Scanner: High-Precision 3D Inspection for Mouse Lens and Micro Parts

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Application of 3D DIC Technology in Forming Limit Curve (FLC) Determination for Sheet Metal Stamping

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High-Speed DIC Technology for UAV Rotor Dynamic Deformation and Trajectory Attitude Analysis

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Application of High-Speed DIC System in Impact Transient Deformation Measurement

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3D DIC Technology for Dynamic Displacement Measurement of Backpack Straps in Shaking Table Simulation Tests

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3D DIC Technology & Solutions for Material Testing Under Extreme Conditions

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3D Micro-DIC Strain Measurement in Micro-Scale Material & Component Testing

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High-Precision DIC Measurement Solution for Chip Thermal Warpage and Deformation

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Measuring Coefficient of Thermal Expansion (CTE) of Monocrystalline Silicon Using Micro-DIC Technology

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3D-DIC Dynamic Displacement and Trajectory Measurement for Nuclear Power Plant Pump Components

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Micro-DIC Measurement Solution for Thermal Warpage and Deformation in Advanced Chip Packaging

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Thermal Warpage and Deformation Analysis of Semiconductor Silicon Wafers Based on 3D DIC Technology

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Teaching and Research

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Consumer Electronics

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Heavy Machinery

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Semiconductor

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Material Testing

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Aerospace

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DIC technology for earthquake simulation/vibration characteristic analysis of civil engineering structures

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XTOP3D DIC three-dimensional dynamic measurement system for aircraft space attitude measurement

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Application of DIC technology in dynamic deformation measurement of large aircraft wings

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