Rail Transit

XTOP3D’s 3D DIC solutions revolutionize rail transit safety with non-contact, high-precision structural health monitoring. Leveraging advanced digital image correlation (DIC), the XTDIC systems deliver full-field strain, 3D displacement, and dynamic vibration data for railway tracks, tunnel simulations, and bridge load testing, ensuring infrastructure reliability in complex service environments.

DIC rail transit, 3D DIC structural testing, railway track displacement measurement, tunnel deformation monitoring, bridge load structure DIC, full-field strain measurement, XTDIC-SPARK, high-speed DIC vibration analysis, slope stability optical meas
Empowering Scenarios

  • In railway track structure displacement testing, DIC technology can be used to analyze the three-dimensional displacement changes and vibrations of the track structure when a train passes, significantly improving measurement accuracy and data reliability. It can also measure tiny displacements and deformations of track welds, allowing for the timely identification of potential structural problems.

    Track displacement and deformation detection

    Track displacement and deformation detection

  • 3D DIC technology is used for bridge structural health monitoring, analyzing the lateral displacement and strain of bridge supports under service loads, studying the mechanical model of bridge main beams, and analyzing the deformation of key load-bearing structures and full-field displacement changes of bridges without affecting structural functions.
    Bridge load structure deformation detection

    Bridge load structure deformation detection

  • Tunnel excavation will disturb the ground. By building a similar material model and using DIC technology for tunnel excavation structure monitoring, we can analyze the displacement changes and collapse evolution process of the geological layer, intuitively reveal the surface subsidence trajectory, and provide data support for engineering risk assessment.
    Tunnel structure deformation simulation test

    Tunnel structure deformation simulation test

  • Using DIC technology, combined with large-scale shaking table simulation tests, we analyze the displacement response characteristics of rock slopes under different earthquake intensities, observe the collapse of slope structures during simulated earthquakes, and measure the overall displacement of slopes, which helps to more accurately reinforce and protect slopes.
    Slope deformation mechanism test

    Slope deformation mechanism test

    • Application Cases
    • Railway Track Displacement & Vibration Measurement with 3D-DIC
      Railway Track Displacement & Vibration Measurement with 3D-DIC
      XTOP3D’s XTDIC-STROBE and XTDIC-SPARK systems use 3D digital image correlation (3D-DIC) for non-contact measurement of railway track displacement, deformation, and vibration. Full-field displacement maps and time-series data reveal the response of rails and fasteners during lateral loading and impact tests, supporting fastener performance evaluation, vibration analysis, structural optimization, and simulation validation.
      View Details >
    • 3D DIC for Bridge, Tunnel & Slope Deformation Monitoring
      3D DIC for Bridge, Tunnel & Slope Deformation Monitoring
      XTOP 3D’s XTDIC system uses 3D digital image correlation to measure full-field displacement and strain in bridges, tunnels, and slopes. Its non-contact measurements track deformation and crack propagation, providing quantitative data for physical model testing, structural and support design optimization, and construction risk assessment.
      View Details >
    • 3D DIC for Geotechnical Model Testing & Failure Analysis
      3D DIC for Geotechnical Model Testing & Failure Analysis
      Measure full-field 3D displacement and surface strain in geotechnical scale models with XTOP3D’s XTDIC system. Using non-contact digital image correlation (DIC), researchers can track ground settlement, strain localization and crack development during tunnel excavation and slope stability tests. The results support failure mechanism analysis, comparison of support schemes and numerical model validation.
      View Details >
    More Cases >
    • Contact Us
      Contact Us

      Welcome for business negotiations. We look forward to cooperating with you.

      Online Chat

    Need help choosing your instruments?

    Tell us about your project and our team of experts will advise you on the best solution for you.

    Get a Quote

    Contact Us

    • Shenzhen Address：
      Orbbec Technology Building, No. 88 High-tech North 1st Road, Nanshan District, Shenzhen, China
    • Xian Address：
      1&2 F, Building 10, Phase II, Fengdong Free Trade Industrial Zone, No. 2168, Zhenghe 4th Road, Fengdong New Town, Xixian New District, Xi'an, China
    • Phone：
      +86 0755-86665401
    • Email：
      market@xtop3d.com
    • XTOP 3D Technology (Shenzhen) Co., Ltd.
    • dic数字散斑,dic全场应变测量系统,dic测量系统
    • 视频引伸计,高精度三维扫描仪,dic全场应变测量系统
    • dic数字散斑,dic全场应变测量系统,dic测量系统
    • 3d dic,新拓三维,数字图像相关法
    Copyright © 2013-2025 XTOP. All Rights Reserved. 粤ICP备18034042号

    Back Home

    Privacy Policy

    Site Map