XTDIC-MICRO Series

3D microstrain measurement system

Watch Video
Microscopic strain measurement, microscopic dic system, microscopic strain measurement system, three-dimensional microscopic strain measurement system
Watch Video
Microscale Mechanical In-Situ Loading and DIC Measurement Solutions
The XTDIC-MICRO 3D microscopic strain measurement system combines a stereo microscope with DIC technology, addressing the limitations of traditional 3D measurement methods for measuring the deformation of tiny objects with nanometer-level accuracy. The microscopic DIC system can be combined with mechanical/thermal testing machines to provide measurement solutions for mechanical and thermodynamic studies of materials as small as 1-10 mm.
Technical characteristics

Technical characteristics

• Measurement field of view 1-10mm
• Accuracy up to 20με, range 0.005%-500%
• Chip warpage accuracy 0.1μm
• 2D and 3D coordinates, displacement, deformation
• Multiple strain tensors
• Elastic modulus, Poisson's ratio, n-value, r-value, yield strength
• Material parameter determination (CTE)
• High-precision photolithography calibration element
• Microscopic automatic calibration technology, microspotting technology
• Rigid displacement elimination technology, fogging suppression technology, thermal airflow suppression technology
• Thermal research, temperature chamber (-190-600°C)
• Micro-material mechanical testing, testing machine (5000N)

Intelligent software

XTDIC software allows direct control of the measurement head and controller to complete various testing tasks. The software automatically calculates test data and provides powerful post-processing and report generation capabilities.
Full-field displacement and strain measurement based on speckle matching;
Motion trajectory posture measurement based on marker detection;
Static deformation measurement based on photogrammetry;
Keypoint motion trajectory measurement based on feature matching.
Learn More >
Intelligent software
Typical Configuration
Model XTDIC-MICRO-SD XTDIC-MICRO-SR XTDIC-MICRO-HR
Specification 5M 5M 12M
Camera resolution 5 megapixels x2 5 megapixels x2 12 megapixels x2
Camera frame rate
 		75fps 75fps 30 fps
Strain measurement accuracy 30με 30με 20με
Strain measurement range 0.005%~500% 0.005%~500% 0.005%~500%
Measuring field of view 2mm~10mm 1mm~10mm 1.5mm~13mm
Working distance 83.4mm 61.5mm 61.5mm
Total magnification 0.6x~4.8x 0.64x~8x 0.64x~8x
Industry Applications
The XTDIC-MICRO microstrain measurement system is suitable for three-dimensional full-field strain and deformation measurement of small-sized specimens. It is widely used in mechanical property testing of mesoscopic material specimens, chip thermal expansion and thermal warpage, CTE parameter determination, semiconductor design verification and process improvement, and other fields.
Learn More >
  • +Chip thermal warpage
  • +Material Testing
  • +CTE parameter determination
  • +Design verification and process improvement
    • Customer Cases
    More Cases >

    Need help choosing your instruments?

    Tell us about your project and our team of experts will advise you on the best solution for you.

    Get a Quote

    Contact Us

    • Shenzhen Address：
      Orbbec Technology Building, No. 88 High-tech North 1st Road, Nanshan District, Shenzhen, China
    • Xian Address：
      1&2 F, Building 10, Phase II, Fengdong Free Trade Industrial Zone, No. 2168, Zhenghe 4th Road, Fengdong New Town, Xixian New District, Xi'an, China
    • Phone：
      +86 0755-86665401
    • Email：
      market@xtop3d.com
    • XTOP 3D Technology (Shenzhen) Co., Ltd.
    • dic数字散斑,dic全场应变测量系统,dic测量系统
    • 视频引伸计,高精度三维扫描仪,dic全场应变测量系统
    • dic数字散斑,dic全场应变测量系统,dic测量系统
    • 3d dic,新拓三维,数字图像相关法
    Copyright © 2013-2025 XTOP. All Rights Reserved. 粤ICP备18034042号

    Back Home

    Privacy Policy

    Site Map