Consumer Electronics

XTOP3D offers advanced 3D Digital Image Correlation (DIC) solutions tailored for the consumer electronics R&D and reliability testing. The non-contact XTDIC system accurately measures full-field strain, transient displacement, and material deformation during flexible screen bending, high-speed phone drops, and durability fatigue tests, providing crucial data to optimize product design.

Flexible Display Bending & Foldable Testing
Video Center

DIC technology is used for full-field strain testing of flexible folding screens on mobile phones

Date:2025-04-29

Flexible screens have ushered in an era of foldable mobile phones. Compared to traditional screens, flexible screens are thinner and lighter, consume less power, and are significantly more durable due to their bendability and flexibility. It can be said that the application of flexible screens has opened the door to innovation in mobile phone products.

Currently, flexible screen products are in their developmental stages, with many technologies still under continuous improvement. Furthermore, flexible screens are used for numerous bending and folding scenarios. Insufficient bending strength can shorten the lifespan of flexible screens. Bending tests on flexible screens according to international/industry standards, measuring maximum stress, maximum deformation, bending stress, bending strength, and elastic model parameters, can effectively improve product quality.

The XTDIC 3D digital speckle full-field strain measurement system was used to analyze strain concentration areas and their magnitude during the bending process of mobile phone screens.