Consumer Electronics

DIC technology is applied to mechanical testing and R&D of consumer electronics. It can measure the dynamic strain and deformation of components in service, evaluate the effects of loads such as compression, twisting, bending, dropping, and collision on components, analyze the mechanical properties of materials and structures, and provide designers with test data verification to optimize product design.

Flexible screen bending test
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DIC technology is used for full-field strain testing of flexible folding screens on mobile phones

Date:2025-04-29

Flexible screens have ushered in an era of foldable mobile phones. Compared to traditional screens, flexible screens are thinner and lighter, consume less power, and are significantly more durable due to their bendability and flexibility. It can be said that the application of flexible screens has opened the door to innovation in mobile phone products.

Currently, flexible screen products are in their developmental stages, with many technologies still under continuous improvement. Furthermore, flexible screens are used for numerous bending and folding scenarios. Insufficient bending strength can shorten the lifespan of flexible screens. Bending tests on flexible screens according to international/industry standards, measuring maximum stress, maximum deformation, bending stress, bending strength, and elastic model parameters, can effectively improve product quality.

The XTDIC 3D digital speckle full-field strain measurement system was used to analyze strain concentration areas and their magnitude during the bending process of mobile phone screens.