+Material Testing
• DIC technology is applicable to any material
• DIC software analyzes Young's modulus, Poisson's ratio, N value, and R value
• Mechanical testing (tension, compression, bending, torsion, shear)
• Fatigue and creep testing
• CTE testing and semiconductor device warpage
+Real-time measurement and analysis of parts
• Performance testing
• Quality assessment
• Guiding the assembly process
+Multi-media environmental measurement
3D DIC system has strong environmental adaptability and can measure high and low temperature, underwater, mirror and vacuum environments.
+Multi-head stereo measurement
The multi-camera DIC measurement system uses multiple sets of measuring heads, which are calibrated in a unified coordinate or aligned in advance, and aligned frame by frame; by unifying the coordinates in three-dimensional space, stereo or ultra-large range measurement can be achieved.
+Simulation results verification
• Complex problem discovery
• Simulation parameter tuning
• Manufacturing process optimization