To further advance academic exchange in the field of mechanical property testing for micro-specimens and to promote the standardization of testing methods, the "2025 3rd Symposium on Micro-specimen Mechanical Testing Methods and Technologies" was held in Tonglu, Hangzhou, from October 23 to 25. The event was guided by the China Metallurgical Information and Standardization Institute and hosted by the School of Materials Science and Engineering at Zhejiang University and the Zhejiang Institute of Science and Innovation for New Materials. XTOP3D, a global provider of R&D and technical solutions for 3D optical measurement and testing equipment, was invited to participate, drawing on its extensive expertise in measuring the mechanical properties of micro-scale materials and semiconductor chips.
This conference aims to provide a platform for academic exchange regarding new theories, technologies, and methods in the field of mechanical property testing of material microspecimens, as well as the standardization of relevant testing procedures, thereby further advancing standardization efforts in this area. More than 200 experts and representatives from nearly 100 enterprises, research institutes, universities, and testing organizations across the country—all engaged in research on the mechanics of microspecimens—attended the event.
As a national high-tech enterprise, XTOP3D possesses deep technical expertise and extensive project experience in the field of mechanical property testing solutions for micro-specimens. At this conference, XTOP3D presented the XTDIC-MICRO 3D microscopic strain measurement system and demonstrated its applications in mechanical property testing for micro-specimens and thermomechanical property testing for semiconductor chips.
In the field of micro-scale material testing, the XTOP3D XTDIC-MICRO 3D microscopic strain measurement system—distinguished by its powerful capabilities, exceptional measurement accuracy, and stable performance—can be integrated with various peripherals (such as environmental chambers/thermal stages, in-situ testing machines, and vibration isolation tables). It is widely used to conduct comprehensive mechanical property testing—including tensile, compressive, shear, fatigue, and high-temperature creep tests—on micro-scale materials across diverse environmental conditions.
In the field of microelectronic packaging testing, the XTDIC-MICRO system utilizes Digital Image Correlation (DIC) technology combined with a stereo microscope to measure surface deformation, strain, and warpage in chip specimens subjected to applied loads and varying temperatures. By combining the optical stereo microscope with software capable of complex distortion correction, the system achieves high-magnification measurement, making it ideal for measuring Z-axis displacement and warpage in chips. This system has already been successfully implemented in collaboration with several leading semiconductor manufacturers, delivering excellent results.
XTOP3D XTDIC-MICRO 3D Micro-scale Strain Measurement System
In situ tensile testing of micro-scale materials
Analysis of Crack Propagation in Material Microstructure
Radial compression test of micro-scale carbon fiber rods (diameter approx. 5–9 mm)
Case Study on Thermodynamic Performance Testing of Semiconductor Chips
Measurement of component thermal warpage
Measurement of thermal deformation of components
In-plane strain measurement of chip cross-sections
In-plane strain of ceramic substrates with copper foil for printed circuit boards
With the rapid advancement of technology, the field of mechanical property testing for material microspecimens is embracing new opportunities for growth. The successful hosting of this seminar has not only established an efficient platform for industry professionals to exchange ideas but has also charted a clear course for the future development of microspecimen mechanical testing technologies. Moving forward, XTOP3D remains committed to its vision of being a global provider of R&D and technical solutions for 3D optical measurement and testing equipment, dedicated to driving progress and innovation in the mechanical property testing of microspecimens.
