Latest Events

XTOP3D releases the latest news and information, providing you with first-hand information about the company.
high-speed DIC, digital image correlation, explosion mechanics, impact testing, Hopkinson bar test, transient deformation, full-field strain measurement, XTDIC-SPARK, 3D dynamic measurement, crack propagation analysis, high strain rate mechanics, non

High-Speed DIC Technology: Capturing Transient Deformation in Explosion Mechanics

Date:2026-03-25

The 15th National Academic Conference on Explosion Mechanics was held in Shaoxing on June 28, bringing together over 2,000 experts and scholars from across the country in the fields of explosion mechanics and impact dynamics. Participants engaged in academic exchanges focusing on key topics such as engineering applications of explosion and impact dynamics, dynamic mechanical behavior and damage/fracture of materials, engineering blasting and damage assessment, energetic materials and underwater explosions, and structural dynamic response and safety protection.

The 15th National Conference on Explosion Mechanics

XTOP3D possesses a deep understanding of the rigorous demands that explosion mechanics research places on testing equipment—specifically the need for high speed, high precision, high reliability, and robust environmental adaptability. Accordingly, during the conference, XTOP3D highlighted its high-speed Digital Image Correlation (DIC) measurement solutions tailored to this field and showcased classic application cases within the academic community of explosion mechanics to the attending experts and scholars.

XTOP3D Shares Applications of High-Speed DIC Technology in Explosion Mechanics

High-Speed Digital Image Correlation (HS-DIC) Measurement Solution


Ultra-high-speed camera systems represent a significant advancement in explosion mechanics research. With ultra-high frame rates reaching the million-frames-per-second (fps) range, nanosecond-level exposure precision, and ultra-high resolution, these systems provide researchers with unprecedented visualization capabilities. They enable the clear capture of transient processes occurring on microsecond or even nanosecond timescales—such as the propagation of explosive shock waves, the dynamic initiation and propagation of material cracks, and the dynamic deformation and failure of structures—thereby greatly enhancing the understanding of complex transient physical phenomena.

The XTOP3D XTDIC-SPARK 3D high-speed measurement system enables ultra-high-speed measurement at rates exceeding 1 million fps with a tracking precision of up to 0.01 pixels. It synchronously records external loading or displacement data on a frame-by-frame basis, facilitating non-contact, full-field dynamic strain measurement during ultra-high-speed tests. The testing process does not interfere with the structural or kinematic characteristics of the target, ensuring that measurement results are visual, objective, and reliable.

Product diagram of the XTOP3D XTDIC-SPARK 3D high-speed measurement system

Typical applications of high-speed DIC technology include (but are not limited to) crash testing, explosion testing, impact testing, drop testing, and vibration analysis. Below are several examples of high-speed DIC technology applied to high-speed impact deformation testing.


1. High-speed DIC for analyzing the dynamic deformation of armor-piercing projectiles during high-speed impact

Experimental methods are used to reveal the dynamic deformation behavior of armor-piercing projectiles during high-speed impact—covering stages such as target contact, penetration, and fracture—which is crucial for understanding ballistic limits and evaluating ballistic performance. By combining high-speed cameras with Digital Image Correlation (DIC) technology, the transient deformation behavior of the projectile during impact can be fully recorded.

High-speed DIC measurement technology for dynamic deformation analysis of armor-piercing projectiles under high-speed impact

Testing Challenges:


  • Speckle patterns are prone to detaching under high-speed impact;
  • Precisely synchronizing the triggering of the experimental setup (e.g., the launcher and target positioning) with the high-speed camera and light source is difficult;
  • Factors such as image noise, lighting variations, and lens distortion affect measurement accuracy;


High-speed DIC measurement technology for dynamic deformation analysis of armor-piercing projectiles under high-speed impact

Solution:


  • Generate the speckle pattern using a specialized technique, eliminating the need for primer spraying;
  • Utilize a high-speed data acquisition card and ensure precise synchronization among the high-speed camera, light source, and sensors.
  • The XTDIC-SPARK system enables full-resolution image calibration and testing at target resolutions and speeds, employing robust correlation algorithms to suppress noise and ensure measurement accuracy.


Test Results:


The following presents the transient deformation analysis and displacement curves for the high-speed armor-piercing projectile obtained via DIC:

High-speed DIC measurement technology for dynamic deformation analysis of armor-piercing projectiles under high-speed impact

2. High-speed DIC for deformation monitoring during high-speed Hopkinson bar impact tests


Hopkinson bar tests are primarily used to determine material properties—such as Young's modulus, Poisson's ratio, stress wave propagation velocity, and stress-strain relationships—under high strain rates. These measurements are fundamental to understanding material behavior under dynamic loads (e.g., collisions, explosions, and impacts). High-speed DIC is particularly well-suited for such applications, leveraging its non-contact nature to capture high-speed loading and transient responses.

High-speed DIC measurement technology for deformation monitoring under high-speed Hopkinson bar impact

Testing Challenges:


  • Extremely high impact velocities and very short time windows;
  • Complex and severe deformation, demanding high robustness and sub-pixel accuracy from DIC;
  • Under high-speed impact, the speckle pattern must remain clearly visible and easily identifiable within the camera's field of view.


High-speed DIC measurement technology for deformation monitoring under high-speed Hopkinson bar impact

Solution:

Utilize a high-performance, high-speed camera featuring a high frame rate, high resolution, wide dynamic range, and excellent imaging capabilities;
Employ robust Digital Image Correlation (DIC) algorithms, strain-rate-sensitive deformation calculation methods, and noise suppression techniques;
Apply a specialized speckle pattern to the specimen surface to ensure that the texture remains clearly visible during the transient impact event.

Test Results:


The XTDIC-SPARK 3D high-speed measurement system successfully acquired displacement field data with high spatiotemporal resolution for the material under high-speed impact loading, revealing the spatial distribution and evolution process of the sheet's deformation.

High-speed DIC measurement technology for deformation monitoring under high-speed Hopkinson bar impact

3. High-speed DIC for analyzing transient crack evolution during high-speed compression


In engineering structures, the propagation of crack damage in materials is a critical factor affecting structural safety and reliability. This experiment employs high-speed compression testing, utilizing high-speed cameras in conjunction with Digital Image Correlation (DIC) technology to comprehensively record the transient deformation and crack propagation behavior of the material under compressive impact.

Testing Challenges:


The test involves high-speed loading, making the securing of square specimens challenging;
Monitoring deformation and forming speeds;
Analyzing crack evolution during the impact transient.

High-speed DIC measurement technology for the analysis of transient crack evolution during high-speed compression.

Solution:


  • Square specimens are secured with screws from multiple directions to ensure they do not shift during impact;
  • High-performance high-speed cameras and high-speed data acquisition cards are utilized;
  • High-speed image sequences and DIC displacement/strain maps are used to analyze the dynamic crack propagation process.


High-speed DIC measurement technology for the analysis of transient crack evolution during high-speed compression.

Fixing method for square test specimens

Test Results:


Displacement and strain field contour plots; crack width variation plots.

High-speed DIC measurement technology for the analysis of transient crack evolution during high-speed compression.

High-speed DIC measurement technology for the analysis of transient crack evolution during high-speed compression.

High-speed DIC measurement technology for the analysis of transient crack evolution during high-speed compression.

Recommended Information

  • At the China Materials Conference 2026 in Wuhan, XTOP 3D showcased its self-developed XTDIC series of 3D full-field strain measurement products. Addressing the limitations of traditional single-point mechanical testing, the non-contact optical DIC solutions provide high-precision, non-destructive evaluation across diverse conditions—including quasi-static, high-temperature coupling, cyclic fatigue, and high-speed impact—to accelerate new material R&D and reliability verification.
    2026-07-17
  • XTOP3D made a significant appearance at the China-Europe Symposium on Biomaterials (CESB 2026), showcasing its XTDIC 3D full-field strain measurement system and XTOM high-precision 3D scanner to empower innovation in biomaterials and medical devices. Leveraging a portfolio of 3D optical measurement solutions, the company supports a wide range of applications—including mechanical property testing for biomaterials, digital dentistry, high-precision dimensional inspection of implants, and comprehensive testing for deformation, posture, and fatigue—thereby safeguarding product quality across the industry through professional technology.
    2026-07-10
  • XTOP3D participated in the 3rd Symposium on Mechanical Testing Methods and Technologies for Micro-specimens, showcasing its 3D microscopic strain measurement system and demonstrating its applications in areas such as mechanical property testing of materials at the mesoscale, as well as thermal (warpage and CTE measurement) and mechanical deformation analysis of semiconductor devices.
    2026-03-25
  • XTOP3D showcased its XTDIC 3D full-field strain measurement system at the China Materials Conference 2025, demonstrating the system's application in mechanical testing for new material R&D. The system supports a wide range of tests—including tension, compression, bending, torsion, and shear—and accommodates static, quasi-static, and dynamic strain, vibration, and high-speed deformation measurements, as well as testing in extreme high- and low-temperature environments. It also features connectivity modules for various testing machines to meet diverse experimental requirements.
    2026-03-25
  • XTOP3D has been invited to exhibit at the Chinese Congress of Theoretical and Applied Mechanics 2025, where it will showcase the XTDIC 3D full-field strain measurement system and its applications in areas such as static load testing, dynamic fatigue testing, and 3D deformation and strain measurement. DIC technology provides researchers with reliable experimental data for studying the mechanical properties of various materials and structures.
    2026-03-25
  • At the 2025 SAMPE International Advanced Composites Exhibition, XTOP3D successfully demonstrated its industry-leading XTDIC Optical Strain Measurement System. Utilizing advanced Digital Image Correlation (DIC) technology, the system delivers high-precision, non-contact, and full-field 3D deformation and strain measurements. XTOP3D highlighted the critical role of DIC technology in evaluating the mechanical properties of advanced composite materials, offering reliable testing solutions tailored for demanding sectors such as aerospace, automotive, and civil engineering. The showcase solidifies XTOP3D's position as a premier innovator in optical metrology and structural testing solutions.
    2026-03-25