XTDIC

3D full-field strain measurement and analysis software

XTDIC analysis software, dic software, dic software functions, dic analysis software
From digital stereo images to 3D measurement data
XTDIC software can perform full-field displacement and strain measurement based on speckle matching, motion trajectory posture measurement based on marker point detection, static deformation measurement based on photogrammetry, and key point motion trajectory measurement based on feature matching. It has also developed specialized functional modules such as digital-to-analog comparison analysis, vibration modal analysis, probe measurement, and crack trajectory measurement to meet the application needs of different test scenarios and provide professional DIC digital image-related measurement data and reports.
Powerful data measurement capabilities

Powerful data measurement capabilities

• Strain ex, ey, exy, shear angle, principal strain, secondary strain, Mises strain, Tresca strain, strain gradient (gradient tensor), thickness reduction rate, linear strain;
• xyz coordinates (Cartesian coordinates), z-onxy (depth), radial distance, radial angle (polar coordinates);
• Geometric analysis, distance (difference, rate of change), angle (difference, rate of change), GD&T;
• Structural features, points, lines, surfaces, circles, spheres, cylinders, cones, coordinate systems, curved surfaces;
• Elastic modulus, Poisson's ratio, n-value, r-value, yield strength;
• Modal analysis, FFT analysis, ODS, OMA, UFF;
• Angular displacement, angular velocity, angular acceleration, rotational speed;
• xyz displacement, velocity, acceleration; • Material forming limits, FLC, FLD;
• Crack opening displacement, COD, CTOD; • Warpage, coefficient of thermal expansion, CTE;
• Temperature field (coordinate coupling), temperature difference; • Trajectory pose (6-DoF);
• CAD comparison deviation; • FEA comparison deviation;
XTDIC software advantages and features
The XTDIC software system combines the simultaneous acquisition and evaluation of probe images and analog data, providing a complete workflow from measurement data acquisition and analysis to reporting.
  • Multiple tracking technologies

    Speckle full-field measurement, circular marker tracking, feature point tracking (cross mark, etc.) and multi-feature composite measurement.
  • Flexible computing

    Online real-time calculation, automatic full-process calculation, and independent and combined calculation of key measurement objects, areas, time domain frames or different processes.
  • Full scene calibration

    Calibration of monocular, binocular, and multi-ocular measurement systems can accurately calibrate conventional, ultra-short-focus, ultra-long-focus, stereo microscopes, tunnel microscopes, complex media and other optical systems.
  • Multiple measurement modes

    Monocular 2D measurement, monocular 3D measurement, binocular 3D measurement, multi-camera free combination measurement and infrared temperature field camera coupling.
  • Rich measurement data

    18 types of strain calculation results; displacement, velocity, acceleration, angular velocity, angular acceleration, rigid body 6-DOF solution.
  • Platform & SDK, compatibility

    The underlying data is compatible, functional modules are interconnected and shared, and the open SDK allows for combination to solve complex scientific problems. Compatible with hundreds of cameras, mechanical, and thermal equipment.
  • Native camera controls

    Natively integrated camera control, real-time image acquisition, and support for multiple triggering methods accurately capture the entire process of measurement events; support for external image and video import; support for image-free mode (only importing 2D image points or 3D point coordinates).
  • Powerful post-processing and analysis functions

    Multiple coordinate system construction and conversion; automatic data interpolation, hole filling and smoothing, and rigid displacement removal; creation of multiple geometric elements and distance, angle, and velocity analysis based on the created elements; capable of cross-section analysis and deformation domain analysis.
Featured function modules
  • • Real-time image acquisition and calculation
    • Real-time data monitoring and feedback control
    RT real-time computing analysis

    RT real-time computing analysis

  • • Extensometer
    • Fatigue testing
    • E,μ,n,r
    MAT Material Testing and Analysis

    MAT Material Testing and Analysis

  • • Feature point motion tracking and deformation analysis
    • Rigid body motion trajectory and posture measurement
    TRACK motion trajectory posture

    TRACK motion trajectory posture

  • • Stereo microscope calibration, tunneling microscope timeline calibration
    • Calibration optimization based on speckle data
    • Chip microwarpage measurement
    • Rigid displacement removal
    MICRO measurement

    MICRO measurement

  • • CAD model import (STEP, IGE, STL)
    • Automatic coordinate alignment and deviation calculation for models
    • Result-driven CAD modeling, digital twin
    CAD digital-analog comparison analysis

    CAD digital-analog comparison analysis

  • • ODS and OMA analysis
    • FFT time-frequency analysis
    • UFF model output
    FFT vibration modal analysis

    FFT vibration modal analysis

  • • Ansys and ABAQUS data alignment
    • FEA data interpolation and deviation comparison
    FEA finite element comparison

    FEA finite element comparison

  • • Fracture frame location
    • FLC curve testing and generation
    • FLD failure analysis
    FLC forming limit analysis

    FLC forming limit analysis

  • • Crack tip trajectory tracking measurement
    • Crack tip opening displacement, COD/CTOD
    COD and crack trajectory measurements

    COD and crack trajectory measurements

  • • Landmark detection and recognition
    • Multi-view 3D reconstruction and bundle adjustment
    • Static deformation measurement
    DP Photogrammetry

    DP Photogrammetry

  • • Probe & adapter calibration
    • Construction and measurement of lines, surfaces, holes, and other elements
    • Coordinate system conversion and quality inspection, virtual assembly
    LOC probe measurement

    LOC probe measurement

  • • Infrared camera control and calibration
    • Temperature field measurement and data coupling
    • Thermal expansion coefficient measurement and analysis
    CTE thermal deformation measurement

    CTE thermal deformation measurement