Latest Events

XTOP3D releases the latest news and information, providing you with first-hand information about the company.
XTOP3D events, 3D measurement exhibitions, industrial trade shows, upcoming expos, 3D scanning technology demonstrations,3D DIC, tube inspection.
  • XTOP 3D, XTDIC system, 3D full-field strain measurement, China Materials Conference 2026, mechanical characterization, non-contact optical measurement, material testing solutions
    At the China Materials Conference 2026 in Wuhan, XTOP 3D showcased its self-developed XTDIC series of 3D full-field strain measurement products. Addressing the limitations of traditional single-point mechanical testing, the non-contact optical DIC solutions provide high-precision, non-destructive evaluation across diverse conditions—including quasi-static, high-temperature coupling, cyclic fatigue, and high-speed impact—to accelerate new material R&D and reliability verification.
    2026-07-17
    XTOP 3D, XTDIC system, 3D full-field strain measurement, China Materials Conference 2026, mechanical characterization, non-contact optical measurement, material testing solutions
    17
    2026-07
  • 3D DIC, strain measurement, digital image correlation, CESB 2026, biomaterials testing, biomechanics research, medical device R&D, non-contact optical measurement, full-field deformation, XTOP3D, soft tissue mechanics, bone mechanical properties, 3D
    XTOP3D made a significant appearance at the China-Europe Symposium on Biomaterials (CESB 2026), showcasing its XTDIC 3D full-field strain measurement system and XTOM high-precision 3D scanner to empower innovation in biomaterials and medical devices. Leveraging a portfolio of 3D optical measurement solutions, the company supports a wide range of applications—including mechanical property testing for biomaterials, digital dentistry, high-precision dimensional inspection of implants, and comprehensive testing for deformation, posture, and fatigue—thereby safeguarding product quality across the industry through professional technology.
    2026-07-10
    3D DIC, strain measurement, digital image correlation, CESB 2026, biomaterials testing, biomechanics research, medical device R&D, non-contact optical measurement, full-field deformation, XTOP3D, soft tissue mechanics, bone mechanical properties, 3D
    10
    2026-07
  • micro-DIC system,3D micro-strain measurement,digital image correlation,XTOP3D,micro-mechanical testing,chip warpage measurement,semiconductor thermal deformation,XTDIC-MICRO,in-situ tensile test,full-field strain analysis,optical strain gauge,microel
    XTOP3D participated in the 3rd Symposium on Mechanical Testing Methods and Technologies for Micro-specimens, showcasing its 3D microscopic strain measurement system and demonstrating its applications in areas such as mechanical property testing of materials at the mesoscale, as well as thermal (warpage and CTE measurement) and mechanical deformation analysis of semiconductor devices.
    2026-03-25
    micro-DIC system,3D micro-strain measurement,digital image correlation,XTOP3D,micro-mechanical testing,chip warpage measurement,semiconductor thermal deformation,XTDIC-MICRO,in-situ tensile test,full-field strain analysis,optical strain gauge,microel
    25
    2026-03
  • 3D DIC, digital image correlation, full-field strain measurement, material mechanics testing, XTDIC, non-contact strain measurement, high-speed DIC, 3D strain analysis, tensile testing DIC, compression testing DIC, crack propagation analysis, Hopkins
    XTOP3D showcased its XTDIC 3D full-field strain measurement system at the China Materials Conference 2025, demonstrating the system's application in mechanical testing for new material R&D. The system supports a wide range of tests—including tension, compression, bending, torsion, and shear—and accommodates static, quasi-static, and dynamic strain, vibration, and high-speed deformation measurements, as well as testing in extreme high- and low-temperature environments. It also features connectivity modules for various testing machines to meet diverse experimental requirements.
    2026-03-25
    3D DIC, digital image correlation, full-field strain measurement, material mechanics testing, XTDIC, non-contact strain measurement, high-speed DIC, 3D strain analysis, tensile testing DIC, compression testing DIC, crack propagation analysis, Hopkins
    25
    2026-03
  • DIC technology, 3D strain measurement system, digital image correlation, full-field strain measurement, material mechanics testing, CCTAM 2025, non-contact optical measurement, high-temperature tensile test, fatigue crack growth, split-Hopkinson pres
    XTOP3D has been invited to exhibit at the Chinese Congress of Theoretical and Applied Mechanics 2025, where it will showcase the XTDIC 3D full-field strain measurement system and its applications in areas such as static load testing, dynamic fatigue testing, and 3D deformation and strain measurement. DIC technology provides researchers with reliable experimental data for studying the mechanical properties of various materials and structures.
    2026-03-25
    DIC technology, 3D strain measurement system, digital image correlation, full-field strain measurement, material mechanics testing, CCTAM 2025, non-contact optical measurement, high-temperature tensile test, fatigue crack growth, split-Hopkinson pres
    25
    2026-03
  • high-speed DIC, digital image correlation, explosion mechanics, impact testing, Hopkinson bar test, transient deformation, full-field strain measurement, XTDIC-SPARK, 3D dynamic measurement, crack propagation analysis, high strain rate mechanics, non
    This article highlights the application of XTOP3D’s XTDIC-SPARK 3D high-speed measurement system in explosion mechanics and high-strain-rate impact testing. It focuses on three typical application scenarios: Analysis of transient deformation and displacement curves during high-speed armor-piercing projectile impact; Full-field strain monitoring with high spatiotemporal resolution during Hopkinson Bar impact tests; Quantitative analysis of transient crack evolution and propagation behavior in materials during high-speed compression tests. Key technical breakthroughs include achieving sub-pixel measurement accuracy under conditions of ultra-high speeds, short time windows, and severe deformation, as well as overcoming challenges related to the acquisition of specialized speckle patterns.
    2026-03-25
    high-speed DIC, digital image correlation, explosion mechanics, impact testing, Hopkinson bar test, transient deformation, full-field strain measurement, XTDIC-SPARK, 3D dynamic measurement, crack propagation analysis, high strain rate mechanics, non
    25
    2026-03
  • DIC optical strain measurement, 3D full-field strain measurement, digital image correlation technology, composite materials testing, SAMPE 2025 exhibition, XTOP3D, XTDIC system, mechanical properties of composites, non-contact deformation measurement
    At the 2025 SAMPE International Advanced Composites Exhibition, XTOP3D successfully demonstrated its industry-leading XTDIC Optical Strain Measurement System. Utilizing advanced Digital Image Correlation (DIC) technology, the system delivers high-precision, non-contact, and full-field 3D deformation and strain measurements. XTOP3D highlighted the critical role of DIC technology in evaluating the mechanical properties of advanced composite materials, offering reliable testing solutions tailored for demanding sectors such as aerospace, automotive, and civil engineering. The showcase solidifies XTOP3D's position as a premier innovator in optical metrology and structural testing solutions.
    2026-03-25
    DIC optical strain measurement, 3D full-field strain measurement, digital image correlation technology, composite materials testing, SAMPE 2025 exhibition, XTOP3D, XTDIC system, mechanical properties of composites, non-contact deformation measurement
    25
    2026-03
  • 3D full-field strain measurement, 3D-DIC technology, XTDIC-CONST, XTOP3D, APCOM 2025, computational mechanics, structural health monitoring, material mechanics testing, non-contact strain measurement, deformation measurement system, mechanical proper
    At the 9th Asia-Pacific Congress on Computational Mechanics (APCOM 2025) in Brisbane, Australia, XTOP3D successfully showcased its cutting-edge XTDIC-CONST Series 3D Full-Field Strain Measurement System. Integrating advanced 3D Digital Image Correlation (3D-DIC) technology, the system delivers non-contact, continuous, and comprehensive deformation and strain measurements for materials and structures under various loading conditions. Unlike traditional contact-based methods, the XTDIC-CONST series excels in demanding and specialized scenarios, including mechanical testing of flexible materials, high-temperature/high-pressure environments, large-deformation analysis, and micro-scale specimen measurements. The technology bridges the gap between machine learning methodologies and structural health monitoring, providing highly accurate, reliable performance data for material research, aerospace engineering, civil structures, and biomechanics. XTOP3D’s presentation at APCOM 2025 garnered significant acclaim from international researchers and practicing engineers.
    2025-12-09
    3D full-field strain measurement, 3D-DIC technology, XTDIC-CONST, XTOP3D, APCOM 2025, computational mechanics, structural health monitoring, material mechanics testing, non-contact strain measurement, deformation measurement system, mechanical proper
    09
    2025-12
  • XTOP3D, high-precision 3D scanner, blue light 3D scanning, XTOM 3D scanner, XTOM-TransForm-ROB, automated 3D inspection, 3D industrial inspection, reverse engineering, 3D printed parts inspection, Belt and Road Science and Technology Innovation Exhib
    XTOP3D Showcases High-Precision 3D Scanning Solutions at the Belt and Road Science and Technology Innovation Exhibition At the "Belt and Road" Science and Technology Innovation Achievements Exhibition held in Chengdu, hosted by the Ministry of Science and Technology and the Sichuan Provincial Government, XTOP3D prominently featured its cutting-edge optical measurement technologies. The company showcased its flagship XTOM high-precision blue light 3D scanner and the XTOM-TransForm-ROB automated 3D scanning and inspection system. These state-of-the-art systems deliver comprehensive, professional solutions tailored for diverse applications, including 3D industrial inspection, reverse engineering, 3D printed parts inspection, as well as advanced teaching and scientific research, underscoring XTOP3D's leadership in non-contact optical measurement.
    2025-06-19
    XTOP3D, high-precision 3D scanner, blue light 3D scanning, XTOM 3D scanner, XTOM-TransForm-ROB, automated 3D inspection, 3D industrial inspection, reverse engineering, 3D printed parts inspection, Belt and Road Science and Technology Innovation Exhib
    19
    2025-06
  • blue light 3d scanner, automated 3d inspection, 3d scanning industrial inspection, automated measurement system, optical 3d measurement, 3d surface scanning, robotic 3d scanning, automotive 3d inspection, aerospace blade measurement, XTOP3D news, 9th
    At the 9th Silk Road International Exposition in Xi'an, XTOP3D successfully showcased its cutting-edge blue light 3D scanning and automated inspection solutions, addressing critical pain points in industrial manufacturing such as strict precision requirements and low inspection efficiency.
    2025-05-29
    blue light 3d scanner, automated 3d inspection, 3d scanning industrial inspection, automated measurement system, optical 3d measurement, 3d surface scanning, robotic 3d scanning, automotive 3d inspection, aerospace blade measurement, XTOP3D news, 9th
    29
    2025-05
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