Latest Events

XTOP3D releases the latest news and information, providing you with first-hand information about the company.
XTOP3D events, 3D measurement exhibitions, industrial trade shows, upcoming expos, 3D scanning technology demonstrations,3D DIC, tube inspection.
  • intelligent inspection, Industry 4.0, 3D inspection technology, automated 3D scanning, in-line inspection, 3D deformation measurement, non-contact strain measurement, digital image correlation, XTOP3D, manufacturing quality control, smart manufacturi
    In the era of Industry 4.0, manufacturing is shifting from mass production to high-mix, low-volume, and lean manufacturing models. At the Industrial Innovation Forum, Lu Gang, Deputy General Manager of XTOP3D, highlighted that while this flexibility helps manufacturers adapt to volatile markets, it introduces severe challenges for shop-floor scheduling, efficiency, and quality control. Traditional spot-checking methods are no longer sufficient to guarantee precision. Consequently, comprehensive and in-line 3D inspection has emerged as the mandatory new standard. XTOP3D addresses these modern manufacturing demands with its advanced, non-contact 3D optical metrology, digital image correlation (DIC), and automated scanning systems, enabling seamless smart inspection and ensuring robust quality assurance across complex production lines.
    2025-03-27
    intelligent inspection, Industry 4.0, 3D inspection technology, automated 3D scanning, in-line inspection, 3D deformation measurement, non-contact strain measurement, digital image correlation, XTOP3D, manufacturing quality control, smart manufacturi
    27
    2025-03
  • 3D DIC, non-contact strain measurement, optical strain measurement system, digital image correlation, full-field strain analysis, 3D deformation measurement, XTOP3D, material mechanical testing, FEA validation, video extensometer
    Developed by XTOP3D, the DIC-3D non-contact 3D optical strain measurement system utilizes digital image correlation (DIC) technology to deliver advanced full-field deformation and strain analysis. Operating without physical contact, the system supports both online and offline real-time calculations, bypassing the need for traditional strain gauges. It adapts to various material types and testing rates under static or dynamic conditions. The system is widely applied in materials research (e.g., tensile, bending, and fatigue testing), operational component analysis (twisting, displacement, and vibration), and finite element analysis (FEA) simulation validation. By comparing empirical measurement data with theoretical models, XTOP3D helps manufacturers optimize product design, improve simulations, and accelerate time-to-market.
    2025-03-27
    3D DIC, non-contact strain measurement, optical strain measurement system, digital image correlation, full-field strain analysis, 3D deformation measurement, XTOP3D, material mechanical testing, FEA validation, video extensometer
    27
    2025-03
  • non-contact strain measurement, 3D DIC software, digital image correlation, full-field strain analysis, 3D deformation measurement, optical strain testing, multi-camera DIC system, XTDIC software, displacement measurement, material testing software
    This article highlights the key advantages of XTOP3D’s non-contact strain measurement software powered by Digital Image Correlation (DIC) technology. The XTDIC software platform offers six core capabilities: complete data traceability, flexible data acquisition control, and seamless synchronized measurement using multi-camera groups (1–8 cameras). Additionally, it delivers advanced digital image detection for 3D full-field dynamic data (including displacement, velocity, and temperature fields), robust 6-DOF rigid body motion analysis, and comprehensive strain calculations featuring 18 advanced algorithms for static, dynamic fracture, and fatigue testing.
    2025-03-27
    non-contact strain measurement, 3D DIC software, digital image correlation, full-field strain analysis, 3D deformation measurement, optical strain testing, multi-camera DIC system, XTDIC software, displacement measurement, material testing software
    27
    2025-03
  • Digital Image Correlation, DIC technology, DIC working principle, 3D full-field strain measurement, optical strain measurement, digital speckle pattern, image processing technology, XTDIC system, material mechanics deformation, non-contact strain mea
    This article provides a comprehensive overview of Digital Image Correlation (DIC) technology, an optical, non-contact method used for measuring material mechanical strain and deformation. By tracking the gray-level variations of speckle patterns on an object's surface during deformation, DIC delivers accurate 2D and 3D full-field strain data. Developed by the expert research team from Xi'an Jiaotong University, XTOP3D’s advanced XTDIC system represents top-tier independent intellectual property in China. Transitioning from its legacy XJTUDIC system, the modern XTDIC 3D full-field strain measurement system delivers highly customizable, industry-specific measurement solutions for global clients in aerospace, materials testing, and automotive industries.
    2025-03-27
    Digital Image Correlation, DIC technology, DIC working principle, 3D full-field strain measurement, optical strain measurement, digital speckle pattern, image processing technology, XTDIC system, material mechanics deformation, non-contact strain mea
    27
    2025-03
  • XTOP3D, 3D Optical Measurement, DIC System, Digital Image Correlation, 3D Full-Field Strain Measurement, 3D Scanning Inspection, XTDIC System, XTOM 3D Scanner, Industrial 3D Metrology, Non-Contact Strain Gauge, Deformational Analysis, Optical Metrolo
    Founded in 2013 by Dr. Tang Zhengzong and an elite alumni team from Xi'an Jiaotong University, XTOP3D has emerged as a global pioneer in 3D optical measurement and DIC (Digital Image Correlation) technology. Driven by continuous R&D investment, the company has contributed to numerous national strategic projects and formulated multiple national industrial standards, earning prestigious technological invention awards. XTOP3D's proprietary product portfolio—anchored by the XTDIC 3D full-field strain measurement system and the XTOM 3D scanning and inspection series—delivers high-precision, non-contact metrology solutions across diverse sectors including aerospace, automotive manufacturing, advanced materials research, and semiconductors. Today, XTOP3D represents world-class performance, leading the transformation of automated industrial inspection.
    2025-03-27
    XTOP3D, 3D Optical Measurement, DIC System, Digital Image Correlation, 3D Full-Field Strain Measurement, 3D Scanning Inspection, XTDIC System, XTOM 3D Scanner, Industrial 3D Metrology, Non-Contact Strain Gauge, Deformational Analysis, Optical Metrolo
    27
    2025-03
  • 3D scanning in EV manufacturing, 3D scanner for automotive, new energy vehicle inspection, 3D industrial inspection, optical 3D measurement, EV parts dimension inspection, automotive reverse engineering, motor core 3D testing, PCU inspection, sheet m
    As the automotive industry shifts toward electric vehicles, precise dimensional control becomes critical for manufacturers. This article explores the vital role of XTOP3D's 3D scanning solutions in new energy vehicle (NEV) manufacturing. Utilizing advanced blue-light 3D scanning and photogrammetry, the technology delivers high-precision measurement data for complex components. Key applications include full-vehicle dimensional inspection, reverse engineering, power control unit (PCU) verification, sheet metal stamping deviation analysis, motor core stacking alignment, and onboard charger component testing. XTOP3D empowers automotive suppliers to correct manufacturing deviations, optimize assembly fit, and ensure design standard compliance.
    2025-03-27
    3D scanning in EV manufacturing, 3D scanner for automotive, new energy vehicle inspection, 3D industrial inspection, optical 3D measurement, EV parts dimension inspection, automotive reverse engineering, motor core 3D testing, PCU inspection, sheet m
    27
    2025-03
  • XTOP3D, TCT Asia, 3D scanning booth, digital image correlation, DIC strain measurement, 3D modeling solutions, material testing system, additive manufacturing inspection, optical 3D measurement, 3D industrial inspection, additive manufacturing qualit
    TCT Asia 2020 will be grandly held at the Shanghai New International Expo Centre from July 8 to 10, 2020!
    2025-03-27
    XTOP3D, TCT Asia, 3D scanning booth, digital image correlation, DIC strain measurement, 3D modeling solutions, material testing system, additive manufacturing inspection, optical 3D measurement, 3D industrial inspection, additive manufacturing qualit
    27
    2025-03
  • 3D DIC, digital image correlation, XTOP3D, SAMPE China, 3D full-field strain measurement, composite material testing, optical metrology, microscopic strain measurement, XTDIC, material deformation testing, advanced materials upgrading
    At the SAMPE China annual conference, XTOP3D successfully demonstrated its industry-leading XTDIC 3D optical full-field strain measurement system and advanced Digital Image Correlation (DIC) technology. Aligning with the theme of green innovation in composite materials, XTOP3D highlighted its cutting-edge solutions for mechanical property testing, micro-scale deformation analysis, and structural strength validation. The systems effectively address industry bottlenecks in evaluating new materials, providing critical experimental data for sectors like aerospace, automotive, and materials manufacturing. The exhibition solidified XTOP3D's role in boosting quality improvement and driving the industrial upgrading of the advanced materials sector.
    2025-03-27
    3D DIC, digital image correlation, XTOP3D, SAMPE China, 3D full-field strain measurement, composite material testing, optical metrology, microscopic strain measurement, XTDIC, material deformation testing, advanced materials upgrading
    27
    2025-03
  • 3D DIC, Digital Image Correlation, 3D full-field strain measurement, structural protection, dynamic testing, earthquake simulation, concrete cracking test, non-contact strain measurement, optical measurement system, XTOP3D, deformation tracking, stru
    XTOP3D recently participated in the 2nd National Academic Seminar on Engineering Structural Protection Under Dynamic Multi-Hazards. As a leading provider of 3D optical measurement solutions, XTOP3D showcased its proprietary XTDIC 3D full-field strain measurement system. The event focused on addressing engineering challenges caused by natural disasters like earthquakes and typhoons, as well as accidental impacts and explosions. The XTDIC system delivers comprehensive static and dynamic test data for material mechanics, fatigue failure, and structural safety. Through non-contact optical testing and finite element analysis (FEA) validation, the system effectively analyzes deformation, cracking, and displacement. It has proven highly successful in critical scenarios including seismic concrete cracking tests, reinforced concrete frame tracking, granite fracture simulation under strong tremors, and subway tunnel deformation monitoring during excavation, unlocking new possibilities for disaster prevention and structural engineering mitigation.
    2025-03-27
    3D DIC, Digital Image Correlation, 3D full-field strain measurement, structural protection, dynamic testing, earthquake simulation, concrete cracking test, non-contact strain measurement, optical measurement system, XTOP3D, deformation tracking, stru
    27
    2025-03
  • 数字图像相关法,拍照式三维扫描仪,dic应变测量
    From July 7 to 10, 2021, XTOP3D, a provider of 3D optical measurement solutions, showcased its offerings at the 16th Shanghai International Automotive Manufacturing Technology & Equipment and Materials Exhibition (AMTS 2021) at the Shanghai New International Expo Centre.
    2025-03-27
    数字图像相关法,拍照式三维扫描仪,dic应变测量
    27
    2025-03
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