The XTOP3D XTDIC 3D full-field strain measurement system enables precise traceability of PCB failures—such as board warpage, solder cracking, and component misalignment—caused by thermal deformation under high-temperature conditions. Utilizing DIC technology, the system tracks warpage profiles, strain distribution, and residual creep data across the entire temperature range, achieving high-precision, micron-level detection of full-field deformation. This provides reliable data to support thermal reliability design and process optimization in electronic packaging.