DIC technology can be integrated with various test equipment (test benches, infrared cameras, environmental chambers, etc.). In extreme environments such as high and low temperatures, underwater high pressure, reflective mirrors, and vacuum, DIC software algorithms resolve optical distortion problems and obtain accurate 3D topography, displacement field, and strain information.

The XTDIC-SPARK 3D high-speed measurement system can directly control high-speed camera acquisition, enabling non-contact full-field dynamic strain measurement for extreme tests such as high-speed and ultra-high-speed tests. It is particularly suitable for high-speed impact tests (Hopkinson bar tests) and transient tensile fracture tests.

The 3D-DIC technology testing system can overcome the "decorrelation" interference caused by thermal radiation, heat flow disturbance and speckle quality degradation, and realize mechanical testing of materials in a high-temperature environment of 2300°C; it can be connected with an infrared camera to realize coupled measurement of temperature field and 3D strain field in a high-temperature environment.

In response to the needs of fatigue, creep, high-speed, and multi-probe stereo testing, the XTDIC three-dimensional full-field strain measurement system uses DIC algorithms and functional modules to meet the measurement requirements of materials under different working conditions and testing environments.

The XTOP3D XTDIC-Micro microstrain measurement system combines DIC technology with a stereo microscope. Using a DIC algorithm to correct optical magnification distortion and noise, it can perform deformation measurements at high magnifications. It is suitable for testing micro-sized materials such as composite fibers, microelectronics, micro components, and biomaterials.