When bending, flexible mobile phone screens are prone to creases, fractures, wrinkles, creep, and other problems. DIC technology can be used to measure the strain field and displacement field during the bending process of the screen, and analyze its maximum stress, maximum deformation, bending stress, bending strength, elastic model and other parameters.

DIC technology is used in cylindrical loading experiments and three-point bending experiments to analyze the compressive mechanical properties of mobile phone glass outer screens and measure the displacement and strain fields on the mobile phone glass surface during cylindrical compression and bending. The measurement data helps mobile phone manufacturers develop mobile phone outer screen glass with strong compressive performance.

The XTDIC three-dimensional full-field strain system can be used for mechanical testing of consumer product structural shells, simulating the mechanical properties of consumer product-related materials and structures under actual usage conditions, such as collision, fatigue, and fracture, providing data support for product optimization and improvement.