The XTDIC-MICRO micro-strain measurement system, when used with various in-situ loading testers, can perform multi-performance mechanical property tests such as tension, compression, and cycling on mesoscopic specimens, achieve full-field strain measurement of tiny specimens, and obtain stress-strain engineering curves.

The XTDIC-MICRO microstrain measurement system, combined with an optical hot and cold stage for temperature loading, performs thermal expansion (CTE) tests on specimens, outputs CTE at different positions in the X and Y directions, and semiconductor thermal expansion test data, helping to improve the stability of semiconductor devices.

The XTDIC-MICRO microstrain measurement system, combined with a temperature-controlled chamber, analyzes the dynamic deformation of semiconductors during temperature changes and packaging process testing. This allows the mechanical properties of different chip cross-section materials to be evaluated under temperature changes, and the reliability of the materials can be verified by comparing them with the theoretical design values.