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3D DIC, non-contact strain measurement, optical strain measurement system, digital image correlation, full-field strain analysis, 3D deformation measurement, XTOP3D, material mechanical testing, FEA validation, video extensometer

DIC-3D: Advanced Non-Contact 3D Optical Strain Measurement System

Date:2025-03-27

Developed and manufactured by XTOP3D, the DIC-3D non-contact 3D optical strain measurement system employs a non-contact measurement method and offers multiple operating modes. It meets diverse requirements regarding testing rates, resolution, and measurement ranges; unaffected by material type, it is suitable for static or dynamic experiments on a wide variety of materials.


Features


Real-time measurement, calculation, and output

It enables real-time full-field strain calculation and result display, eliminating the need for post-processing. 3D full-field strain calculations are performed in real-time alongside image acquisition. The system supports both online and offline processing modes and allows for the real-time output of calculation results via protocols such as UDP.

Non-contact full-field measurement


Measurements are not limited to single points; full-field deformation can be observed without the need to attach strain gauges. Measurement is achieved simply by applying speckle paint to the surface of the object.


data


Applications


Materials Research

The DIC-3D non-contact optical strain measurement system enables the analysis of material mechanical properties and behavior across a wide range of complex testing environments. It integrates seamlessly with existing test rigs and testing machines, utilizing non-contact measurement heads to measure full-field 3D strain and deformation in both soft and hard materials under mechanical and thermal loading. Capable of replacing traditional extensometers and strain gauges, it facilitates real-time 3D surface deformation analysis.


  • Full-field strain distribution
  • Stress-strain curve
  • Young's modulus
  • Poisson's ratio
  • n-value & r-value
  • Tensile test
  • Shear test
  • Three-point/four-point bending test
  • Fatigue test



Component Testing and Analysis

The DIC-3D non-contact optical strain measurement system is not constrained by the geometry or material of the component; testing remains unaffected even when the component is under operational conditions.

This system integrates easily with standard or custom test rigs to measure dynamic deformation—evaluating factors such as twisting, bending, displacement, velocity, and acceleration—and to analyze operational safety risks, service life, creep, aging, and surface changes. It provides designers with experimental validation to optimize product designs.


  • Strength analysis
  • Vibration analysis
  • Durability analysis
  • Crash testing


Validation through Finite Element Analysis and Simulation

During product design and manufacturing, manufacturers are increasingly utilizing finite element analysis (FEA) software to conduct simulations, thereby optimizing and improving both product performance and manufacturing processes. The DIC-3D non-contact 3D optical strain measurement system enables the comparison and analysis of actual test results against theoretical data from FEA software; this effectively refines simulation tools and processes, builds a valuable data repository for projects, and helps manufacturers accelerate their time-to-market.

  • Compare simulation data with actual measurement results (strain, displacement, etc.)
  • Determine material properties and input them into the software as parameters for realistic simulation
  • Validate via digital simulation

Recommended Information

  • At the China Materials Conference 2026 in Wuhan, XTOP 3D showcased its self-developed XTDIC series of 3D full-field strain measurement products. Addressing the limitations of traditional single-point mechanical testing, the non-contact optical DIC solutions provide high-precision, non-destructive evaluation across diverse conditions—including quasi-static, high-temperature coupling, cyclic fatigue, and high-speed impact—to accelerate new material R&D and reliability verification.
    2026-07-17
  • XTOP3D made a significant appearance at the China-Europe Symposium on Biomaterials (CESB 2026), showcasing its XTDIC 3D full-field strain measurement system and XTOM high-precision 3D scanner to empower innovation in biomaterials and medical devices. Leveraging a portfolio of 3D optical measurement solutions, the company supports a wide range of applications—including mechanical property testing for biomaterials, digital dentistry, high-precision dimensional inspection of implants, and comprehensive testing for deformation, posture, and fatigue—thereby safeguarding product quality across the industry through professional technology.
    2026-07-10
  • XTOP3D participated in the 3rd Symposium on Mechanical Testing Methods and Technologies for Micro-specimens, showcasing its 3D microscopic strain measurement system and demonstrating its applications in areas such as mechanical property testing of materials at the mesoscale, as well as thermal (warpage and CTE measurement) and mechanical deformation analysis of semiconductor devices.
    2026-03-25
  • XTOP3D showcased its XTDIC 3D full-field strain measurement system at the China Materials Conference 2025, demonstrating the system's application in mechanical testing for new material R&D. The system supports a wide range of tests—including tension, compression, bending, torsion, and shear—and accommodates static, quasi-static, and dynamic strain, vibration, and high-speed deformation measurements, as well as testing in extreme high- and low-temperature environments. It also features connectivity modules for various testing machines to meet diverse experimental requirements.
    2026-03-25
  • XTOP3D has been invited to exhibit at the Chinese Congress of Theoretical and Applied Mechanics 2025, where it will showcase the XTDIC 3D full-field strain measurement system and its applications in areas such as static load testing, dynamic fatigue testing, and 3D deformation and strain measurement. DIC technology provides researchers with reliable experimental data for studying the mechanical properties of various materials and structures.
    2026-03-25
  • This article highlights the application of XTOP3D’s XTDIC-SPARK 3D high-speed measurement system in explosion mechanics and high-strain-rate impact testing. It focuses on three typical application scenarios: Analysis of transient deformation and displacement curves during high-speed armor-piercing projectile impact; Full-field strain monitoring with high spatiotemporal resolution during Hopkinson Bar impact tests; Quantitative analysis of transient crack evolution and propagation behavior in materials during high-speed compression tests. Key technical breakthroughs include achieving sub-pixel measurement accuracy under conditions of ultra-high speeds, short time windows, and severe deformation, as well as overcoming challenges related to the acquisition of specialized speckle patterns.
    2026-03-25