The XTOP3D DIC full-field strain measurement system utilizes Digital Image Correlation (DIC) technology—an optical method for measuring mechanical strain in materials, also known in the industry as DIC image processing technology. This method tracks the deformation of a speckle pattern on an object's surface and calculates changes in the grayscale values within the speckle region to derive data on surface deformation and strain. Depending on the speckle imaging method and the nature of the calculated results, DIC is categorized into 2D DIC and 3D DIC.
Digital Image Correlation (DIC) technology emerged in the 1980s, initially finding primary application in 2D strain analysis. Since the turn of the 21st century, 3D full-field strain measurement technology has gradually been developed. The Institute of Advanced Manufacturing Technology at the School of Mechanical Engineering, Xi'an Jiaotong University, was the first team in China to develop this technology and bring it to commercial application. The core members of XTOP3D hail from this R&D team and possess fully independent intellectual property rights regarding 3D full-field strain measurement. Regarding product branding, the team's "XJTUDIC 3D Digital Speckle Dynamic Strain and Deformation Measurement System" has been renamed the "XTDIC 3D Full-Field Strain Measurement System." In its current commercial operations, XTOP3D’s XTDIC system closely aligns with the needs of various industries, undergoing continuous product refinement while providing customers with customized measurement solutions.
