The XTOP3D XTOM-STATION automated inspection center utilizes an automated 3D measurement solution combining an industrial robot—equipped with a blue-light 3D scanning probe—and a fully automated rotary table. It captures high-precision, highly detailed 3D data from workpiece surfaces to inspect and analyze specific dimensions or defects on small-to-medium-sized parts, providing an automated 3D measurement solution for a wide range of measurement tasks.

Leveraging advantages such as high precision, non-contact operation, and full-dimensional inspection, the XTOP3D XTOM blue-light 3D scanning and measurement system has become a vital tool for the 3C manufacturing industry to enhance product quality, optimize production processes, and reduce costs; it is widely used in the R&D, production, and quality control of products such as mobile phones, laptops, headphones, and audio equipment.

XTOP3D’s Digital Image Correlation (DIC) technology accurately measures the transient 3D displacement of automotive components under wind tunnel loading conditions. It analyzes the dynamic deformation of parts—such as doors, pillars, and hoods—subjected to aerodynamic forces. The visualized measurement results facilitate the optimization of vehicle body stiffness, the design of aerodynamic kits, and the enhancement of NVH performance.

The newly released XTOM-STATION automated inspection center from XTOP3D features the XTOM MATRIX 12M—a micron-level blue-light 3D scanning head—enabling high-precision, full-dimensional 3D scanning of workpieces with complex surfaces. Integrated with XTOP3D’s proprietary X-INSPECT software, the system streamlines the entire workflow—from scanning and inspection to report generation—making it ideal for automated batch 3D measurement of small-to-medium-sized components in sectors such as automotive manufacturing, aerospace, and precision engineering.

The XTOP3D XTOM-MATRIX 12M is a blue-light 3D scanner offering micron-level precision. Featuring metrology-grade accuracy of 6μm, 12.3-megapixel industrial cameras, exceptional detail capture and reproduction capabilities, high-precision scanning efficiency, and intelligent automated inspection functions, it delivers a revolutionary solution for the 3D digital metrology of complex components, driving simultaneous improvements in production efficiency and product quality.

The XTOP3D XTDIC-MICRO 3D microscopic strain measurement system utilizes microscopic DIC technology to measure the deformation of miniature electronic components under high and low-temperature conditions (25°C–300°C). By analyzing regions of strain concentration and maximum strain data, the system helps prevent failures caused by issues such as mismatched thermal expansion/contraction properties, mismatches in the temperature coefficients of internal leads and die coatings, and chip cracking.

The XTOP3D XTDIC 3D full-field strain measurement system utilizes Digital Image Correlation (DIC) technology to monitor deformation in lattice-anchor models designed for landslide control. Such simulation experiments facilitate a deeper understanding of landslide formation mechanisms, evolutionary processes, and failure modes; they reveal the mechanical responses and deformation patterns of geological bodies under various influencing factors, thereby providing a scientific basis for optimizing reinforcement designs.

The XTOP3D XTOM high-precision 3D scanning and measurement system is utilized across various stages of mold manufacturing—including quality control, assembly, reverse engineering, and wear analysis. It identifies hole center coordinates, diameters, roundness, and positional accuracy (GD&T), ensuring that hole configurations meet rigorous specifications. By helping to address the three core challenges of the mold industry—precision, efficiency, and cost—it enables the creation of traceable quality records.

The XTOP3D XTOM-MATRIX high-precision blue-light 3D scanner is designed for the 3D inspection of irregular, soft, and curved bra pads. It revolutionizes bra pad design and manufacturing workflows through digitization, thereby enhancing product development efficiency and market competitiveness. Blue-light 3D scanning technology accurately captures the detailed features and overall contours of the pads and analyzes cup surface curvature radii, providing essential support for flexible production and on-demand manufacturing.

The XTOP3D XTDIC-SPARK 3D high-speed measurement system is utilized to analyze the dynamic structural response of a large-scale structural model (with a 3m base and a height of approximately 7m) subjected to simulated seismic loads on a six-degree-of-freedom (6-DOF) shaking table. High-speed DIC technology is employed to analyze the displacement and strain fields in critical areas of the model, thereby evaluating its seismic performance, dynamic stability, and failure modes, as well as verifying the effectiveness of its seismic design and the reliability of the structural system.

The XTOP3D XTDIC 3D full-field strain measurement system can be integrated with a temperature test chamber to form a thermal deformation and warpage measurement system. It enables the measurement of flatness and coplanarity for microelectronic devices—such as wafers—under thermal deformation conditions. Additionally, it supports surface strain distribution analysis and Coefficient of Thermal Expansion (CTE) testing, allowing for the early prediction of wafer thermal deformation trends, which aids in semiconductor material research and manufacturing quality assurance.

The XTOM-TRANSFORM automated 3D inspection system performs automatic scanning and compares results against original CAD data to identify deviations. It enables statistical analysis of geometric tolerances, overall deviations, cross-sectional deviations, and curve deviations, while generating comprehensive inspection reports. The system automatically archives measurement data and feature point information, facilitating traceability and analysis for potential component quality issues; it is suitable for quality assurance in high-throughput production environments, as well as for mold development and mass production.

The XTOP3D XTOM-MATRIX high-precision blue-light 3D scanner accurately captures fine surface details of rocks—such as textures, fissures, and undulations. By analyzing 3D data models to assess disturbances and deformations resulting from engineering activities or environmental factors, it facilitates in-depth research into the physical and mechanical properties of rock and soil masses, as well as the patterns of their structural evolution.

The XTOP3D microscopic DIC strain measurement system is designed for measuring the bending deformation and strain of flexible, slender structures such as noodles. Offering advantages such as high resolution, high magnification, and comprehensive data acquisition, it reveals the mechanical behavior of noodles at the micro-scale. By overcoming the limitations of traditional methods regarding precision and applicability to small-scale specimens, it serves as a powerful analytical tool for fields including food science and materials engineering.

The XTOP3D XTDIC 3D full-field strain measurement system employs non-contact, dynamic tracking to monitor surface movement on sand-soil slope models. Utilizing Digital Image Correlation (DIC) technology to analyze displacement and strain fields, the system examines the evolution of deformation to characterize typical "sliding-type" failure modes, thereby providing quantitative data for optimizing landslide remediation projects and designing support structures.

XTOP3D possesses nearly two decades of technical expertise in the field of bent-tube measurement. Its TUBE QUALIFY 3D measurement system is designed for a wide range of complex tubular components, including flexible hoses, free-form bent tubes, variable-diameter tubes, branched tubes, composite tubes, and adapters. With one-click operation, the system captures critical parameters—such as bend point coordinates (XYZ), YBC data, and sleeve tolerances—and the results can be used to calibrate tube-bending machine settings, thereby enhancing setup efficiency.

The XTOP3D XTOM small-format blue-light 3D scanner features a single-scan area of ​​up to 100 mm × 75 mm and is designed for the precise 3D data acquisition of small electronic components—such as those found in 3C mobile devices—to facilitate reverse engineering and full-dimensional 3D inspection. With its micron-level accuracy and high scanning efficiency, it empowers the precision electronics manufacturing industry.

Multiple XTDIC 3D strain measurement systems—comprising standard DIC and microscopic DIC setups—are utilized in conjunction with compact testing machines, multi-channel temperature monitors, and custom explosion-proof enclosures to analyze the displacement and strain fields of molding powder particles (explosive dust) during the incremental pressing process. The DIC systems monitor temperature fluctuations in real-time to assess the process's adaptability and safety, enabling the analysis of parameters such as flow velocity and bulk density, thereby providing a basis for evaluating the requirements of the incremental pressing process.