Vibration table simulation tests were conducted to simulate the swaying of backpack shoulder straps during walking and running, thereby evaluating the backpack's ergonomic design, stability, and comfort. The XTOP3D XTDIC-STROBE 3D dynamic measurement system was used to capture images during the tests, and DIC software analysis yielded data on 3D displacement, motion trajectories, velocity, and acceleration of the shoulder straps during movement.

The XTOM 3D optical scanner is specifically developed and manufactured for industrial 3D scanning, facilitating full-process, full-field digital workflows for industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

The XTOP3D XTDIC 3D full-field strain measurement system overcomes image distortion and noise interference associated with extreme conditions, solving the challenges of DIC measurement in such environments and enabling applications across typical extreme scenarios—including high-temperature, high-speed, multi-scale, and underwater conditions.

The XTOP3D XTDIC 3D full-field strain measurement system meets the requirements for high-precision, full-field measurement of complex structures during static testing. By utilizing full-field displacement and strain data, researchers can gain a more accurate understanding of the deformation and strain behavior of 3D-printed structures under various loads, thereby providing robust support for structural design and optimization.

The XTOM 3D optical scanner is specifically developed and manufactured for industrial 3D scanning, facilitating full-process, full-field digital workflows for industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

Based on Digital Image Correlation (DIC) technology, the DIC 3D full-field strain measurement system monitors the full-field strain of standard nickel-based material tensile specimens. It reveals the mechanical response throughout the entire process—from tensile deformation to fracture—thereby providing a data-driven basis for material design optimization and failure prevention.

XTOP3D’s full-field deformation measurement DIC technology captures baseline contour data to track the displacement of corresponding points under varying thermal loads, enabling the calculation and analysis of strain data. It allows for the simultaneous analysis of chip warpage and the evaluation of soldering processes, as well as the detection of strain concentrations across different materials in cross-sections; furthermore, by measuring the Coefficient of Thermal Expansion (CTE), it facilitates the diagnosis of CTE mismatch issues contributing to thermal warpage in chips.

The XTOM 3D optical scanner is specifically developed and manufactured for industrial 3D scanning, facilitating full-process, full-field digital workflows for industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

The XTOP3D XTDIC-Micro microscopic strain measurement system can be integrated with in-situ testing machines to measure surface topography, deformation, and strain in micro-scale materials. By combining DIC technology with a binocular stereo microscope, the system enables high-magnification deformation measurement, making it suitable for analyzing strain in materials such as composite fibers, microelectronics, micro-components, and biomaterials.

The thermal warpage experiment utilized the XTOP3D XTDIC-MICRO microscopic strain measurement system and a temperature controller (with a precision of ±0.1°C). A measurement platform for chip thermal warpage was established based on microscopic DIC technology to conduct tests on typical stacked structures, enabling real-time observation of the thermal warpage of multilayer boards during heating.

The XTOM 3D optical scanner is a high-precision instrument developed specifically for industrial 3D scanning, designed to facilitate full-process, comprehensive digital workflows in industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

To investigate the dynamic behavior of the pump casing and motor across five stages—pump warming, startup, operation, shutdown, and cooling—the XTOP3D XTDIC-STROBE 3D dynamic measurement system was employed. Digital Image Correlation (DIC) technology was used to analyze deformation-induced misalignment during these stages; displacement-deformation curves for the pump casing, discharge pipe, and suction pipe were plotted to identify the specific locations and sources of the deformation.

In the experimental observation of structural thermal warpage, the primary focus is measuring the out-of-plane displacement caused by the warpage. The XTOP3D XTDIC-MICRO 3D microscopic strain measurement system—which integrates Digital Image Correlation (DIC) technology with a stereo microscope—can be used to measure surface deformation, strain, and warpage in chip specimens subjected to applied loads and varying temperatures. By utilizing the stereo microscope alongside software designed for complex distortion correction, high-magnification measurements can be achieved, making the system suitable for measuring Z-axis displacement and warpage in chips.

The XTOM 3D optical scanner is a high-precision instrument developed specifically for industrial 3D scanning, designed to facilitate full-process, comprehensive digital workflows in industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

An XTDIC 3D full-field strain measurement system, combined with a temperature control chamber, was employed to analyze the thermal deformation of monocrystalline silicon in a high-temperature environment. By tracking speckle patterns on the material's surface, the displacement field distribution across various deformation states was calculated, enabling an analysis of the thermal warpage of the monocrystalline silicon.