The XTOP3D XTDIC-SPARK 3D high-speed measurement system, featuring high-speed DIC technology, is an effective solution for testing 3C electronic products for drop and collision deformation. The high-speed DIC measurement system offers the advantages of non-contact, high-precision, and full-field dynamic measurement. It accurately quantifies changes in displacement and strain fields, as well as failure evolution, helping to accelerate the development of high-reliability electronic devices.

The XTOP3D XTOM industrial-grade blue-light 3D scanner, through non-contact measurement, high-density point cloud coverage, and digital analysis, is suitable for detecting complex curved surface contours and hole position deviations on automotive parts. It provides automotive parts manufacturers with precise and efficient quality control solutions to ensure the quality and assembly accuracy of the final product.

The DIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC), is a method that calculates the displacement field and strain field based on the changes in speckle on the specimen surface. It is suitable for evaluating the mechanical properties of materials under various environmental conditions and analyzing their mechanical performance parameters such as strength, stiffness, plasticity, elasticity, and ductility.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC) technology, can simultaneously measure the morphology, deformation, and strain of materials in high-temperature environments. It can detect surface shape changes caused by high temperatures, reveal the material failure process, and quantitatively determine the critical temperature and strain range for failure.

The XTOP3D XTDIC 3D full-field strain measurement system overcomes image distortion and noise interference under extreme conditions, solving DIC measurement challenges in these conditions and enabling applications in typical extreme conditions such as high temperature, through glass, multi-scale, and underwater.

The XTDIC 3D full-field strain measurement system performs torsional fatigue testing on welded specimens. By monitoring full-field dynamic strain, fatigue damage and crack development in the weld area under torsional loading are analyzed, further enabling analysis of the specimen's fatigue characteristics. Its advantages lie in its non-contact nature, high temporal and spatial resolution, and the potential for coupled multi-physics analysis.

The XTDIC three-dimensional digital speckle full-field strain measurement system is used to analyze the strain concentration area and strain magnitude during the bending process of the mobile phone screen, and the displacement changes during the opening and closing process of the foldable phone are analyzed, providing measurement data basis for mobile phone manufacturers to optimize their products in the future.

The XTOP3D XTDIC-SPARK high-speed 3D measurement system can be used to obtain key data such as mobile phone drop deformation performance, flexural elastic modulus, maximum flexural compressive stress and strain during drop and compression tests. This helps evaluate the mechanical properties and reliability of mobile phone exterior glass and tempered casings.

High-speed digital image correlation (DIC) technology directly controls two high-speed cameras for image acquisition. It is capable of capturing high-speed images of the mobile phone's drop and collision transients, and can accurately measure the product's displacement, speed, posture, strain deformation and other data during a drop.

Using the XTOP3D XTDIC three-dimensional full-field strain measurement system and the high-precision, high-sensitivity full-field non-contact optical measurement characteristics of the digital speckle correlation method (3D-DIC), and using a high-speed camera to capture speckle images, wind tunnel tests were carried out on the blades under different aerodynamic loads and centrifugal loads.

The axle loading test adopts a 1-40 ton load control method and uses 3D-DIC technology for full-field displacement and strain measurement. During the deformation process of the axle, a sequence of images is captured in real time, and data analysis is performed using DIC software to obtain its full-field displacement and strain.

To measure the swing displacement of the crane boom, the XTOP3D XTDIC three-dimensional full-field strain measurement system collects data in real time. Based on the displacement changes of the marked coding points, the swing displacement of the boom in the direction perpendicular to the boom plane is measured.

The XTOP3D XTDIC-SPARK 3D high-speed measurement system uses high-speed DIC technology to directly control high-speed cameras to acquire images. The 3D dynamic measurement and analysis software can provide high-precision displacement, velocity, acceleration and other data, which can be used for transient deformation and vibration analysis of rails.

The XTDIC 3D full-field strain measurement system utilizes digital image correlation (DIC) technology to monitor deformation and displacement in bridges, tunnels, and slopes. By measuring displacement and strain field data on the surface of a structure, it analyzes crack initiation location, size, propagation rate, and dynamic changes in the elastic-plastic stage, providing a reliable solution for studying structural strength and performance.

The XTOP3D XTDIC three-dimensional full-field strain measurement system is used for simulation tests of similar materials. It acquires speckle images of the simulated model under different loads and performs image analysis based on a correlation matching algorithm to quantitatively extract the full-field displacement and strain response information of the structure. This system is used for full-field displacement and deformation measurement, as well as for quantitative analysis of crack development and fracture morphology.

The XTOP3D XTDIC 3D full-field deformation measurement system, based on digital image correlation (DIC) technology, offers the advantages of non-contact, high-precision, and full-field measurement. It can replace traditional measurement methods and is suitable for mechanical property tests such as compression, bending, tension, and splitting of concrete and rock specimens.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC) technology, measures full-field strain, displacement, velocity, acceleration, vibration, and other data without contact with the specimen. Compared to traditional contact sensors, it offers a wider range of applications, easier operation, and more comprehensive data, effectively assisting in automotive design optimization and factory inspection and evaluation.

Digital image correlation (DIC) technology is suitable for studying the laws of rock deformation, movement and failure during mining, especially for rock mechanics problems involving multiple mechanical behaviors such as elastic-plasticity, crushing and collapse. Combined with similar material simulation test methods, DIC technology has been widely regarded as an effective full-field measurement solution.