The XTOM 3D optical scanner is specifically developed and manufactured for industrial 3D scanning, facilitating full-process, full-field digital workflows for industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

The 3C consumer electronics industry is famous for its fast product updates and fierce competition. In this field that pursues ultimate craftsmanship and excellence, product dimensional accuracy, appearance quality, and production efficiency are all crucial. Three-dimensional optical scanning technology is becoming a key technology to promote the upgrading of the 3C consumer electronics industry with its advantages of non-contact, high precision and high efficiency.

The XTOP3D XTDIC-SPARK 3D high-speed measurement system analyzes speckle patterns on the sample surface and captures full-field data using high-speed cameras. When combined with XTDA dynamic analysis software, it enables intuitive, precise, and visual analysis of full-field displacement and strain regions. For the analysis of high-speed events, the system also features marker tracking capabilities.

To eliminate deformation measurement errors caused by glass media at high temperatures, the XTOP3D XTDIC 3D full-field strain measurement system is employed; through high-precision calibration of binocular DIC cameras and optimization algorithms, it effectively reduces errors induced by the glass medium, enabling accurate measurement of high-temperature deformation fields.

The XTOP3D XTOM high-precision blue-light 3D scanner rapidly and accurately captures 3D data from small injection-molded parts. By comparing this data with CAD models using inspection software, a color map visually displays form and positional deviations across the part, enabling a comprehensive analysis and evaluation of its outer contours and dimensions.

The XTOP3D XTOM series is an automated, small-format blue-light 3D scanning system capable of rapid, full-dimensional measurement of mobile phone front and rear faces, middle frames, curved glass, and various components. It streamlines R&D validation and simulation during product design and enhances yield rate control during manufacturing, thereby helping manufacturers boost their competitiveness and accelerate supply chain operations.

The XTOM 3D optical scanner is specifically developed and manufactured for industrial 3D scanning, facilitating full-process, full-field digital workflows for industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

Vibration table simulation tests were conducted to simulate the swaying of backpack shoulder straps during walking and running, thereby evaluating the backpack's ergonomic design, stability, and comfort. The XTOP3D XTDIC-STROBE 3D dynamic measurement system was used to capture images during the tests, and DIC software analysis yielded data on 3D displacement, motion trajectories, velocity, and acceleration of the shoulder straps during movement.

The XTOP3D XTDIC 3D full-field strain measurement system overcomes image distortion and noise interference associated with extreme conditions, solving the challenges of DIC measurement in such environments and enabling applications across typical extreme scenarios—including high-temperature, high-speed, multi-scale, and underwater conditions.

The XTOM 3D optical scanner is specifically developed and manufactured for industrial 3D scanning, facilitating full-process, full-field digital workflows for industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

The XTOP3D XTDIC 3D full-field strain measurement system meets the requirements for high-precision, full-field measurement of complex structures during static testing. By utilizing full-field displacement and strain data, researchers can gain a more accurate understanding of the deformation and strain behavior of 3D-printed structures under various loads, thereby providing robust support for structural design and optimization.

The XTOM 3D optical scanner is specifically developed and manufactured for industrial 3D scanning, facilitating full-process, full-field digital workflows for industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

The XTOM 3D optical scanner is specifically developed and manufactured for industrial 3D scanning, facilitating full-process, full-field digital workflows for industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

The XTOP3D XTDIC-Micro microscopic strain measurement system can be integrated with in-situ testing machines to measure surface topography, deformation, and strain in micro-scale materials. By combining DIC technology with a binocular stereo microscope, the system enables high-magnification deformation measurement, making it suitable for analyzing strain in materials such as composite fibers, microelectronics, micro-components, and biomaterials.

XTOP3D’s full-field deformation measurement DIC technology captures baseline contour data to track the displacement of corresponding points under varying thermal loads, enabling the calculation and analysis of strain data. It allows for the simultaneous analysis of chip warpage and the evaluation of soldering processes, as well as the detection of strain concentrations across different materials in cross-sections; furthermore, by measuring the Coefficient of Thermal Expansion (CTE), it facilitates the diagnosis of CTE mismatch issues contributing to thermal warpage in chips.

Based on Digital Image Correlation (DIC) technology, the DIC 3D full-field strain measurement system monitors the full-field strain of standard nickel-based material tensile specimens. It reveals the mechanical response throughout the entire process—from tensile deformation to fracture—thereby providing a data-driven basis for material design optimization and failure prevention.

The XTOM 3D optical scanner is a high-precision instrument developed specifically for industrial 3D scanning, designed to facilitate full-process, comprehensive digital workflows in industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

The thermal warpage experiment utilized the XTOP3D XTDIC-MICRO microscopic strain measurement system and a temperature controller (with a precision of ±0.1°C). A measurement platform for chip thermal warpage was established based on microscopic DIC technology to conduct tests on typical stacked structures, enabling real-time observation of the thermal warpage of multilayer boards during heating.