As a major global manufacturing hub, China has—through three decades of development—established a comprehensive mold industry system, becoming a leading nation in both mold manufacturing and consumption. In 2018, China’s mold production value exceeded RMB 280 billion, while consumption reached RMB 255 billion, supporting RMB 28 trillion worth of product forming and manufacturing; additionally, mold exports surpassed USD 6 billion.
Launched in 1986 and hosted by the China Die & Mould Industry Association, the China International Die & Mould Technology and Equipment Exhibition (DMC) boasts a history spanning over 30 years. Widely recognized both domestically and internationally for its professionalism and authority, the Shanghai-based event has established itself as a highly renowned professional international exhibition.
XTOP3D will participate in this exhibition, showcasing its latest flagship 3D optical measurement products and solutions:
Blue-Light 3D Inspection
XTOM blue-light 3D scanning utilizes non-contact measurement technology to rapidly capture detailed 3D data of complex, free-form mold surfaces. By comparing the measurement results against the original CAD model, the mold manufacturing process can be optimized or improved, ensuring dimensional accuracy and high quality.
Material and Structural Testing
The XTDIC 3D optical strain measurement system enables the rapid acquisition of mechanical parameters related to strain and cracking in materials and structures. It is suitable for applications such as the study of mechanical properties, structural deformation, fracture mechanics, impact mechanics, product reliability, metal forming, thermal deformation, and surface profiling.
3D Measurement of Bent Tubes
The Tube Qualify 3D optical measurement system is designed for the 3D dimensional inspection of bent tubes, enabling both quantitative and qualitative analysis of bending angles, arc geometry, and springback. It can inspect multiple bent tubes within two seconds and supports real-time, in-line inspection.
