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3D DIC system, digital image correlation, 3D strain measurement, full-field strain analysis, material mechanics testing, non-contact strain gauge, optical deformation measurement, material displacement field, tensile testing DIC, XTOP3D

Application of XTDIC 3D Full-Field Strain Measurement System in Material Mechanics

Date:2025-04-02

The XTOP3D XTDIC speckle strain measurement system integrates Digital Image Correlation (DIC) technology with binocular stereo vision. Utilizing two high-speed cameras, it captures real-time speckle images of the test specimen across various stages of deformation, enabling the measurement of 3D coordinates, displacement fields, and strain fields on the object's surface. It is the first 3D optical strain measurement system in China to feature independently developed core algorithms and proprietary intellectual property, achieving a technical standard comparable to the best internationally.


XTOP3D Speckle Strain Measurement System


A thorough understanding of material properties is crucial when designing new products and manufacturing components, as it enables reliable, effective comparison of design variations and optimization of forming processes. The XTDIC speckle strain measurement system is a non-contact optical system widely used in fields such as materials testing, high-speed deformation analysis, dynamic strain measurement, and biomechanics.

Value of the Speckle Strain Measurement System

The XTOP3D speckle strain measurement system provides customers with accurate and reliable material property data early in the product development cycle. This data helps shorten R&D testing times and enhances the customer's competitive edge in the industry.

Experimental Applications

The XTOP3D speckle strain measurement system is an essential tool for materials testing, allowing for the detailed analysis of mechanical properties—such as the localization of necking during tensile tests or the formation of shear bands during the torsion of thin-walled structures. Unlike traditional methods, this system enables real-time measurement, calculation, and data output.

Recommended Information

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  • XTOP3D made a significant appearance at the China-Europe Symposium on Biomaterials (CESB 2026), showcasing its XTDIC 3D full-field strain measurement system and XTOM high-precision 3D scanner to empower innovation in biomaterials and medical devices. Leveraging a portfolio of 3D optical measurement solutions, the company supports a wide range of applications—including mechanical property testing for biomaterials, digital dentistry, high-precision dimensional inspection of implants, and comprehensive testing for deformation, posture, and fatigue—thereby safeguarding product quality across the industry through professional technology.
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  • XTOP3D participated in the 3rd Symposium on Mechanical Testing Methods and Technologies for Micro-specimens, showcasing its 3D microscopic strain measurement system and demonstrating its applications in areas such as mechanical property testing of materials at the mesoscale, as well as thermal (warpage and CTE measurement) and mechanical deformation analysis of semiconductor devices.
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  • XTOP3D has been invited to exhibit at the Chinese Congress of Theoretical and Applied Mechanics 2025, where it will showcase the XTDIC 3D full-field strain measurement system and its applications in areas such as static load testing, dynamic fatigue testing, and 3D deformation and strain measurement. DIC technology provides researchers with reliable experimental data for studying the mechanical properties of various materials and structures.
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  • This article highlights the application of XTOP3D’s XTDIC-SPARK 3D high-speed measurement system in explosion mechanics and high-strain-rate impact testing. It focuses on three typical application scenarios: Analysis of transient deformation and displacement curves during high-speed armor-piercing projectile impact; Full-field strain monitoring with high spatiotemporal resolution during Hopkinson Bar impact tests; Quantitative analysis of transient crack evolution and propagation behavior in materials during high-speed compression tests. Key technical breakthroughs include achieving sub-pixel measurement accuracy under conditions of ultra-high speeds, short time windows, and severe deformation, as well as overcoming challenges related to the acquisition of specialized speckle patterns.
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