To investigate the dynamic behavior of the pump casing and motor across five stages—pump warming, startup, operation, shutdown, and cooling—the XTOP3D XTDIC-STROBE 3D dynamic measurement system was employed. Digital Image Correlation (DIC) technology was used to analyze deformation-induced misalignment during these stages; displacement-deformation curves for the pump casing, discharge pipe, and suction pipe were plotted to identify the specific locations and sources of the deformation.

The XTOM 3D optical scanner is a high-precision instrument developed specifically for industrial 3D scanning, designed to facilitate full-process, comprehensive digital workflows in industrial inspection. Featuring high-precision detail measurement capabilities and industrial-grade stability, the XTOM scanner is suitable for high-precision data acquisition in a wide range of demanding industrial environments.

An XTDIC 3D full-field strain measurement system, combined with a temperature control chamber, was employed to analyze the thermal deformation of monocrystalline silicon in a high-temperature environment. By tracking speckle patterns on the material's surface, the displacement field distribution across various deformation states was calculated, enabling an analysis of the thermal warpage of the monocrystalline silicon.

In the experimental observation of structural thermal warpage, the primary focus is measuring the out-of-plane displacement caused by the warpage. The XTOP3D XTDIC-MICRO 3D microscopic strain measurement system—which integrates Digital Image Correlation (DIC) technology with a stereo microscope—can be used to measure surface deformation, strain, and warpage in chip specimens subjected to applied loads and varying temperatures. By utilizing the stereo microscope alongside software designed for complex distortion correction, high-magnification measurements can be achieved, making the system suitable for measuring Z-axis displacement and warpage in chips.