The XTOP3D XTDIC-SPARK monocular high-speed DIC measurement system offers non-contact, optical, and non-destructive measurement capabilities. It flexibly adapts to confined spaces and precisely captures high-frequency, micron-level vibrations in precision components. Validated through testing under both variable-frequency and fixed-frequency conditions, the system ensures stable and reliable data acquisition. It simultaneously captures a wide range of full-field dynamic parameters, providing an efficient, precise, and integrated solution for vibration testing and fatigue reliability analysis of precision structures.

The XTOP3D XTDIC-SPARK high-speed measurement system utilizes high-speed Digital Image Correlation (DIC) technology to precisely capture the frequency response curves and mode shapes of PCBs. It clearly reveals multi-order modal parameters, rapidly identifies structural weak points, and helps mitigate resonance risks, thereby providing quantitative data to support vibration optimization and reliability enhancement in PCB design.

The XTOP3D XTDIC-SPARK 3D high-speed measurement system is utilized to analyze the dynamic structural response of a large-scale structural model (with a 3m base and a height of approximately 7m) subjected to simulated seismic loads on a six-degree-of-freedom (6-DOF) shaking table. High-speed DIC technology is employed to analyze the displacement and strain fields in critical areas of the model, thereby evaluating its seismic performance, dynamic stability, and failure modes, as well as verifying the effectiveness of its seismic design and the reliability of the structural system.

The XTOP3D XTDIC-SPARK 3D high-speed measurement system, featuring high-speed DIC technology, is an effective solution for testing 3C electronic products for drop and collision deformation. The high-speed DIC measurement system offers the advantages of non-contact, high-precision, and full-field dynamic measurement. It accurately quantifies changes in displacement and strain fields, as well as failure evolution, helping to accelerate the development of high-reliability electronic devices.

The XTOP3D XTDIC-SPARK high-speed 3D measurement system can be used to obtain key data such as mobile phone drop deformation performance, flexural elastic modulus, maximum flexural compressive stress and strain during drop and compression tests. This helps evaluate the mechanical properties and reliability of mobile phone exterior glass and tempered casings.

High-speed digital image correlation (DIC) technology directly controls two high-speed cameras for image acquisition. It is capable of capturing high-speed images of the mobile phone's drop and collision transients, and can accurately measure the product's displacement, speed, posture, strain deformation and other data during a drop.

The XTOP3D XTDIC-SPARK 3D high-speed measurement system uses high-speed DIC technology to directly control high-speed cameras to acquire images. The 3D dynamic measurement and analysis software can provide high-precision displacement, velocity, acceleration and other data, which can be used for transient deformation and vibration analysis of rails.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC) technology, measures full-field strain, displacement, velocity, acceleration, vibration, and other data without contact with the specimen. Compared to traditional contact sensors, it offers a wider range of applications, easier operation, and more comprehensive data, effectively assisting in automotive design optimization and factory inspection and evaluation.

The XTOP3D XTDIC-SPARK 3D high-speed measurement system directly controls high-speed cameras to capture and track the entire motion process of a target. By utilizing XTDA dynamic analysis software to analyze the transient deformation of a laptop casing during a drop, the system assesses damage and evaluates the drop height tolerance and impact resistance of the product's packaging components.

Utilizing XTOP3D high-speed digital image correlation technology (the XTDIC-SPARK 3D high-speed measurement system), the strain field, displacement distribution, and motion trajectories of key points on the rotor—spanning the entire process from startup to stable rotational speed—can be precisely quantified, providing data support for the design and optimization of UAV rotors.

The XTOP3D XTDIC-SPARK 3D high-speed measurement system analyzes speckle patterns on the sample surface and captures full-field data using high-speed cameras. When combined with XTDA dynamic analysis software, it enables intuitive, precise, and visual analysis of full-field displacement and strain regions. For the analysis of high-speed events, the system also features marker tracking capabilities.