The XTOP3D XTDIC 3D full-field strain measurement system meets the requirements for high-precision, full-field measurement of complex structures during static testing. By utilizing full-field displacement and strain data, researchers can gain a more accurate understanding of the deformation and strain behavior of 3D-printed structures under various loads, thereby providing robust support for structural design and optimization.

The XTOP3D XTDIC-Micro microscopic strain measurement system can be integrated with in-situ testing machines to measure surface topography, deformation, and strain in micro-scale materials. By combining DIC technology with a binocular stereo microscope, the system enables high-magnification deformation measurement, making it suitable for analyzing strain in materials such as composite fibers, microelectronics, micro-components, and biomaterials.

XTOP3D’s full-field deformation measurement DIC technology captures baseline contour data to track the displacement of corresponding points under varying thermal loads, enabling the calculation and analysis of strain data. It allows for the simultaneous analysis of chip warpage and the evaluation of soldering processes, as well as the detection of strain concentrations across different materials in cross-sections; furthermore, by measuring the Coefficient of Thermal Expansion (CTE), it facilitates the diagnosis of CTE mismatch issues contributing to thermal warpage in chips.

Based on Digital Image Correlation (DIC) technology, the DIC 3D full-field strain measurement system monitors the full-field strain of standard nickel-based material tensile specimens. It reveals the mechanical response throughout the entire process—from tensile deformation to fracture—thereby providing a data-driven basis for material design optimization and failure prevention.

The thermal warpage experiment utilized the XTOP3D XTDIC-MICRO microscopic strain measurement system and a temperature controller (with a precision of ±0.1°C). A measurement platform for chip thermal warpage was established based on microscopic DIC technology to conduct tests on typical stacked structures, enabling real-time observation of the thermal warpage of multilayer boards during heating.

An XTDIC 3D full-field strain measurement system, combined with a temperature control chamber, was employed to analyze the thermal deformation of monocrystalline silicon in a high-temperature environment. By tracking speckle patterns on the material's surface, the displacement field distribution across various deformation states was calculated, enabling an analysis of the thermal warpage of the monocrystalline silicon.

In the experimental observation of structural thermal warpage, the primary focus is measuring the out-of-plane displacement caused by the warpage. The XTOP3D XTDIC-MICRO 3D microscopic strain measurement system—which integrates Digital Image Correlation (DIC) technology with a stereo microscope—can be used to measure surface deformation, strain, and warpage in chip specimens subjected to applied loads and varying temperatures. By utilizing the stereo microscope alongside software designed for complex distortion correction, high-magnification measurements can be achieved, making the system suitable for measuring Z-axis displacement and warpage in chips.