Applications

Applications cover aerospace, automotive manufacturing, electronics manufacturing, energy and heavy industry, biomedicine, geotechnical engineering, materials testing and other industries.
Photographic blue light 3D scanner, high-precision 3D scanner, 3D strain measurement system, non-contact strain measurement, digital image correlation method (DIC technology), 3d DIC, video extensometer, 3D bent tube inspection system
  • 三维dic,显微dic应变测量,芯片热翘曲变形
    芯片先进封装中的翘曲与显微DIC测量解决方案
    在结构热翘曲的实验观测中，重点是测量热翘曲引起的离面位移。新拓三维XTDIC-MICRO三维显微应变测量系统，数字图像相关DIC技术结合体式显微镜，可用于测量承受施加载荷、不同温度下的芯片试样表面变形、应变和翘曲。通过使用体式显微镜，以及用于复杂失真校正的软件，可获得高放大倍率测量，适用于测量芯片Z方向位移以及翘曲。
    2025-03-07
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  • XTOP 3D Technology (Shenzhen) Co., Ltd.
  • dic数字散斑,dic全场应变测量系统,dic测量系统
  • 视频引伸计,高精度三维扫描仪,dic全场应变测量系统
  • dic数字散斑,dic全场应变测量系统,dic测量系统
  • 3d dic,新拓三维,数字图像相关法
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