The XTDIC 3D full-field strain measurement system performs torsional fatigue testing on welded specimens. By monitoring full-field dynamic strain, fatigue damage and crack development in the weld area under torsional loading are analyzed, further enabling analysis of the specimen's fatigue characteristics. Its advantages lie in its non-contact nature, high temporal and spatial resolution, and the potential for coupled multi-physics analysis.

The XTDIC three-dimensional digital speckle full-field strain measurement system is used to analyze the strain concentration area and strain magnitude during the bending process of the mobile phone screen, and the displacement changes during the opening and closing process of the foldable phone are analyzed, providing measurement data basis for mobile phone manufacturers to optimize their products in the future.

Using the XTOP3D XTDIC three-dimensional full-field strain measurement system and the high-precision, high-sensitivity full-field non-contact optical measurement characteristics of the digital speckle correlation method (3D-DIC), and using a high-speed camera to capture speckle images, wind tunnel tests were carried out on the blades under different aerodynamic loads and centrifugal loads.

The axle loading test adopts a 1-40 ton load control method and uses 3D-DIC technology for full-field displacement and strain measurement. During the deformation process of the axle, a sequence of images is captured in real time, and data analysis is performed using DIC software to obtain its full-field displacement and strain.

To measure the swing displacement of the crane boom, the XTOP3D XTDIC three-dimensional full-field strain measurement system collects data in real time. Based on the displacement changes of the marked coding points, the swing displacement of the boom in the direction perpendicular to the boom plane is measured.

The XTDIC 3D full-field strain measurement system utilizes digital image correlation (DIC) technology to monitor deformation and displacement in bridges, tunnels, and slopes. By measuring displacement and strain field data on the surface of a structure, it analyzes crack initiation location, size, propagation rate, and dynamic changes in the elastic-plastic stage, providing a reliable solution for studying structural strength and performance.

The XTOP3D XTDIC three-dimensional full-field strain measurement system is used for simulation tests of similar materials. It acquires speckle images of the simulated model under different loads and performs image analysis based on a correlation matching algorithm to quantitatively extract the full-field displacement and strain response information of the structure. This system is used for full-field displacement and deformation measurement, as well as for quantitative analysis of crack development and fracture morphology.

The XTOP3D XTDIC 3D full-field deformation measurement system, based on digital image correlation (DIC) technology, offers the advantages of non-contact, high-precision, and full-field measurement. It can replace traditional measurement methods and is suitable for mechanical property tests such as compression, bending, tension, and splitting of concrete and rock specimens.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC) technology, measures full-field strain, displacement, velocity, acceleration, vibration, and other data without contact with the specimen. Compared to traditional contact sensors, it offers a wider range of applications, easier operation, and more comprehensive data, effectively assisting in automotive design optimization and factory inspection and evaluation.

Digital image correlation (DIC) technology is suitable for studying the laws of rock deformation, movement and failure during mining, especially for rock mechanics problems involving multiple mechanical behaviors such as elastic-plasticity, crushing and collapse. Combined with similar material simulation test methods, DIC technology has been widely regarded as an effective full-field measurement solution.

The DIC three-dimensional strain measurement system can be used to measure the deformation and strain of new energy vehicle battery materials and structures, analyze the mechanical properties of various materials, and measure and analyze the three-dimensional morphology, displacement strain, and deformation of components. It is not restricted by the geometric morphology of materials and components and can perform mechanical property tests under actual working loads.

Based on simulation verification on a 1:10 scale wing test bench, the XTOP3D XTDIC-STROBE 3D dynamic measurement system was used for simultaneous measurement and accuracy comparison. The results verified that the full-field measurement accuracy of the aircraft wing dynamic deformation reached 0.21mm/2m, meeting the requirements for monitoring wing deflection under flight loads. This provides a high-precision full-field dynamic deformation measurement solution for aircraft aeroelastic analysis.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC) technology, can simultaneously measure the morphology, deformation, and strain of materials in high-temperature environments. It can detect surface shape changes caused by high temperatures, reveal the material failure process, and quantitatively determine the critical temperature and strain range for failure.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation technology (DIC), can provide three-dimensional full-field displacement and strain data, and can accurately test the deformation, impact resistance and maximum bearing capacity of bone materials under motion load conditions.

Leg motion is highly variable, which can easily cause leg brace brackets to slip. DIC technology tracks the displacement of leg landmarks, measuring the displacement of the brace and leg during movement, as well as motion posture data, providing data support for brace brace design.

Digital image correlation (DIC) technology is an easy-to-use, non-contact measurement method. DIC technology allows for high-precision measurement of full-field profile, displacement, and strain of implant biomaterials. Providing thousands of measurement points, it helps researchers understand the complex mechanical interactions of implants under loading and obtain high-quality experimental data to optimize simulation and validation models.

To eliminate deformation measurement errors caused by glass media at high temperatures, the XTOP3D XTDIC 3D full-field strain measurement system is employed; through high-precision calibration of binocular DIC cameras and optimization algorithms, it effectively reduces errors induced by the glass medium, enabling accurate measurement of high-temperature deformation fields.

The XTOP3D XTDIC 3D full-field strain measurement system overcomes image distortion and noise interference associated with extreme conditions, solving the challenges of DIC measurement in such environments and enabling applications across typical extreme scenarios—including high-temperature, high-speed, multi-scale, and underwater conditions.