The XTOP3D XTDIC 3D full-field deformation measurement system, based on digital image correlation (DIC) technology, offers the advantages of non-contact, high-precision, and full-field measurement. It can replace traditional measurement methods and is suitable for mechanical property tests such as compression, bending, tension, and splitting of concrete and rock specimens.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC) technology, measures full-field strain, displacement, velocity, acceleration, vibration, and other data without contact with the specimen. Compared to traditional contact sensors, it offers a wider range of applications, easier operation, and more comprehensive data, effectively assisting in automotive design optimization and factory inspection and evaluation.

Digital image correlation (DIC) technology is suitable for studying the laws of rock deformation, movement and failure during mining, especially for rock mechanics problems involving multiple mechanical behaviors such as elastic-plasticity, crushing and collapse. Combined with similar material simulation test methods, DIC technology has been widely regarded as an effective full-field measurement solution.

The DIC three-dimensional strain measurement system can be used to measure the deformation and strain of new energy vehicle battery materials and structures, analyze the mechanical properties of various materials, and measure and analyze the three-dimensional morphology, displacement strain, and deformation of components. It is not restricted by the geometric morphology of materials and components and can perform mechanical property tests under actual working loads.

Based on simulation verification on a 1:10 scale wing test bench, the XTOP3D XTDIC-STROBE 3D dynamic measurement system was used for simultaneous measurement and accuracy comparison. The results verified that the full-field measurement accuracy of the aircraft wing dynamic deformation reached 0.21mm/2m, meeting the requirements for monitoring wing deflection under flight loads. This provides a high-precision full-field dynamic deformation measurement solution for aircraft aeroelastic analysis.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC) technology, can simultaneously measure the morphology, deformation, and strain of materials in high-temperature environments. It can detect surface shape changes caused by high temperatures, reveal the material failure process, and quantitatively determine the critical temperature and strain range for failure.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation technology (DIC), can provide three-dimensional full-field displacement and strain data, and can accurately test the deformation, impact resistance and maximum bearing capacity of bone materials under motion load conditions.

Leg motion is highly variable, which can easily cause leg brace brackets to slip. DIC technology tracks the displacement of leg landmarks, measuring the displacement of the brace and leg during movement, as well as motion posture data, providing data support for brace brace design.

Digital image correlation (DIC) technology is an easy-to-use, non-contact measurement method. DIC technology allows for high-precision measurement of full-field profile, displacement, and strain of implant biomaterials. Providing thousands of measurement points, it helps researchers understand the complex mechanical interactions of implants under loading and obtain high-quality experimental data to optimize simulation and validation models.

为了消除玻璃介质引起的高温DIC变形测量误差，采用新拓三维XTDIC三维全场应变测量系统通过双目DIC相机的高精度标定和优化算法，能够有效减少玻璃介质引起的变形测量误差，实现高温变形场的精确测量。

新拓三维XTDIC三维全场应变测量系统,可克服极端条件下的图像畸变和噪音干扰,解决极端条件下DIC测量难题,实现在高温,高速,多尺度以及水下等典型极端条件中的应用.

新拓三维XTDIC三维全场应变测量系统，可满足复杂结构在静力测试中的高精度、全场测量需求，通过全场位移和应变数据，研究人员能够更准确地了解3D打印结构在承受各种载荷时的变形和应变情况，为结构设计和优化提供有力支持。

新拓三维XTDIC-Micro显微应变测量系统，可与原位试验机结合测量微小尺寸材料表面形状、变形和应变。dic技术结合双目体式显微镜，可完成高放大倍率下的变形测量，适合测量复合纤维、微电子、微小构件、生物材料等微小尺寸材料的应变。

新拓三维全场变形测量DIC技术，通过获取基准状态下的轮廓数据，支持追踪同名点在不同温度载荷下的位移数据，计算分析出应变数据。可同时分析芯片的翘曲和焊接工艺评估、断面不同材料否存在应变集中现象，通过测量CTE，可进一步判定芯片热翘曲CTE失配问题。

DIC三维全场应变测量系统，基于数字图像相关DIC技术，对镍基材料标准拉伸试样进行全场应变监测，揭示其拉伸变形至断裂的全流程力学响应，为材料设计优化与失效预防提供数据驱动依据。

热翘曲实验采用新拓三维XTDIC-MICRO显微应变测量系统及温度控制器（温控±0.1°C），基于显微DIC技术搭建芯片热翘曲测量平台，开展典型叠层结构热翘曲测试，实现多层板在升温过程中热翘曲实时观测。

采用XTDIC三维全场应变测量系统，搭配温度控制箱，分析高温环境下的单晶硅热变形，通过追踪获取单晶硅材料表面的散斑图像，解算出在各个变形状态下单晶硅表面的位移场分布，分析单晶硅材料热翘曲变形情况。

在结构热翘曲的实验观测中，重点是测量热翘曲引起的离面位移。新拓三维XTDIC-MICRO三维显微应变测量系统，数字图像相关DIC技术结合体式显微镜，可用于测量承受施加载荷、不同温度下的芯片试样表面变形、应变和翘曲。通过使用体式显微镜，以及用于复杂失真校正的软件，可获得高放大倍率测量，适用于测量芯片Z方向位移以及翘曲。