Digital Image Correlation (DIC) technology leverages binocular or multi-camera stereo vision and digital speckle matching algorithms to enable non-contact, full-field, and multi-scale synchronous measurement of 3D displacement and strain, even under extreme operating conditions. The XTOP3D XTDIC series encompasses models designed for microscopic, standard, high-temperature, high-speed, and ultra-large field-of-view applications, providing a one-stop solution to meet the needs of academic research, industrial reliability verification, and rigorous mechanical testing for high-end equipment.

The XTOP3D XTDIC-MICRO 3D microscopic strain measurement system utilizes microscopic DIC technology to measure the deformation of miniature electronic components under high and low-temperature conditions (25°C–300°C). By analyzing regions of strain concentration and maximum strain data, the system helps prevent failures caused by issues such as mismatched thermal expansion/contraction properties, mismatches in the temperature coefficients of internal leads and die coatings, and chip cracking.

XTOP3D’s full-field deformation measurement DIC technology captures baseline contour data to track the displacement of corresponding points under varying thermal loads, enabling the calculation and analysis of strain data. It allows for the simultaneous analysis of chip warpage and the evaluation of soldering processes, as well as the detection of strain concentrations across different materials in cross-sections; furthermore, by measuring the Coefficient of Thermal Expansion (CTE), it facilitates the diagnosis of CTE mismatch issues contributing to thermal warpage in chips.

The XTOP3D XTDIC-Micro microscopic strain measurement system can be integrated with in-situ testing machines to measure surface topography, deformation, and strain in micro-scale materials. By combining DIC technology with a binocular stereo microscope, the system enables high-magnification deformation measurement, making it suitable for analyzing strain in materials such as composite fibers, microelectronics, micro-components, and biomaterials.

The thermal warpage experiment utilized the XTOP3D XTDIC-MICRO microscopic strain measurement system and a temperature controller (with a precision of ±0.1°C). A measurement platform for chip thermal warpage was established based on microscopic DIC technology to conduct tests on typical stacked structures, enabling real-time observation of the thermal warpage of multilayer boards during heating.

In the experimental observation of structural thermal warpage, the primary focus is measuring the out-of-plane displacement caused by the warpage. The XTOP3D XTDIC-MICRO 3D microscopic strain measurement system—which integrates Digital Image Correlation (DIC) technology with a stereo microscope—can be used to measure surface deformation, strain, and warpage in chip specimens subjected to applied loads and varying temperatures. By utilizing the stereo microscope alongside software designed for complex distortion correction, high-magnification measurements can be achieved, making the system suitable for measuring Z-axis displacement and warpage in chips.