多套XTDIC三维应变测量系统，常规DIC测量系统与显微DIC系统，配合小型实验机、多路温度测量仪，定制防爆防护罩， 分析造型粉颗粒（炸药粉尘）在分布压装过程中的位移场、应变场计算结果。DIC测量系统实时观测压装过程中温度变化结果，实现对炸药分步压装工艺适应性及安全性的影响，以实时分析其流动速度、堆积密度等参数，为分步压装工艺要求提供评判依据。

新拓三维XTOM蓝光三维扫描仪用于汽车结构件模具3D检测，测量模具不受形状限制，能够快速、准确完成复杂形状中小型模具的尺寸检测。将3D扫描结果与CAD设计模型进行拟合比对，可清晰识别并标记尺寸偏差。

新拓三维XTOM高精度蓝光三维扫描仪，可高精度、高效获取自由曲面的3D点云数据。在电子电路产品3D打印应用中，利用XTOM扫描的高精度曲面数据，可直接在各种电子产品曲面上，打印出具有微米级分辨率和高均匀性的导电电路。这一技术为电路设计提供了更大灵活性，并能更好地适应复杂的表面拓扑结构。

新拓三维XTOM-MATRIX系列高精度蓝光三维扫描仪，配备多种幅面工业相机镜头，测量精度可达6微米，在捕获工件细节特征方面具有出色的实力，可用于检测各类中小型精密零部件的各种线性尺寸、角度尺寸和形位公差，为精密制造行业提供高效、精准的几何尺寸测量解决方案。

XTOP3D's independently developed XTDIC three-dimensional full-field strain measurement system can obtain the ultimate strain under different strain paths through computational analysis, thereby producing a complete forming limit FLC curve, clearly and intuitively judging whether there is excessive deformation in the part area, and providing data support for optimizing the forming process and verifying the simulation.

The XTOP3D Tube Qualify 3D bend tube measurement system features high accuracy, fast speed, simple operation, and excellent repeatability. It is suitable for measuring various types of tubes in aviation, automotive, air conditioning, and marine applications, providing the bend manufacturing industry with a comprehensive solution that can meet various bend quality inspection challenges.

The XTOP3D XTDIC 3D full-field strain measurement system is widely used in deformation and damage testing of thin-film composite materials such as composite braids, composite hollow structure sandwich models, 3D-printed composite structures, and thick-line braids. It has significant advantages in measuring the deformation behavior of composite materials.

The XTOP3D Tube Qualify 3D tube bend online inspection system is an innovative application in the inspection and production process of air conditioning pipe fittings. It measures the bend angle, radius, length, 3D spatial coordinates, and nozzle position of air conditioning pipe bends, and outputs a machining deviation detection report with bend point data (including coordinates and YBC).

The XTOP3D XTDIC-SPARK 3D high-speed measurement system, featuring high-speed DIC technology, is an effective solution for testing 3C electronic products for drop and collision deformation. The high-speed DIC measurement system offers the advantages of non-contact, high-precision, and full-field dynamic measurement. It accurately quantifies changes in displacement and strain fields, as well as failure evolution, helping to accelerate the development of high-reliability electronic devices.

The XTOP3D XTOM industrial-grade blue-light 3D scanner, through non-contact measurement, high-density point cloud coverage, and digital analysis, is suitable for detecting complex curved surface contours and hole position deviations on automotive parts. It provides automotive parts manufacturers with precise and efficient quality control solutions to ensure the quality and assembly accuracy of the final product.

The DIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC), is a method that calculates the displacement field and strain field based on the changes in speckle on the specimen surface. It is suitable for evaluating the mechanical properties of materials under various environmental conditions and analyzing their mechanical performance parameters such as strength, stiffness, plasticity, elasticity, and ductility.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC) technology, can simultaneously measure the morphology, deformation, and strain of materials in high-temperature environments. It can detect surface shape changes caused by high temperatures, reveal the material failure process, and quantitatively determine the critical temperature and strain range for failure.

The XTOP3D XTDIC 3D full-field strain measurement system overcomes image distortion and noise interference under extreme conditions, solving DIC measurement challenges in these conditions and enabling applications in typical extreme conditions such as high temperature, through glass, multi-scale, and underwater.

The XTDIC 3D full-field strain measurement system performs torsional fatigue testing on welded specimens. By monitoring full-field dynamic strain, fatigue damage and crack development in the weld area under torsional loading are analyzed, further enabling analysis of the specimen's fatigue characteristics. Its advantages lie in its non-contact nature, high temporal and spatial resolution, and the potential for coupled multi-physics analysis.

The XTDIC three-dimensional digital speckle full-field strain measurement system is used to analyze the strain concentration area and strain magnitude during the bending process of the mobile phone screen, and the displacement changes during the opening and closing process of the foldable phone are analyzed, providing measurement data basis for mobile phone manufacturers to optimize their products in the future.

The XTOP3D XTDIC-SPARK high-speed 3D measurement system can be used to obtain key data such as mobile phone drop deformation performance, flexural elastic modulus, maximum flexural compressive stress and strain during drop and compression tests. This helps evaluate the mechanical properties and reliability of mobile phone exterior glass and tempered casings.

High-speed digital image correlation (DIC) technology directly controls two high-speed cameras for image acquisition. It is capable of capturing high-speed images of the mobile phone's drop and collision transients, and can accurately measure the product's displacement, speed, posture, strain deformation and other data during a drop.

Using the XTOP3D XTDIC three-dimensional full-field strain measurement system and the high-precision, high-sensitivity full-field non-contact optical measurement characteristics of the digital speckle correlation method (3D-DIC), and using a high-speed camera to capture speckle images, wind tunnel tests were carried out on the blades under different aerodynamic loads and centrifugal loads.