Knowledge Sharing

XTOP3D releases the latest news and information, providing you with first-hand information about the company.
DIC Measurement Accuracy, Digital Image Correlation, Complex Lighting, Sources of Measurement Error, Lighting Control

How does Digital Image Correlation address the challenges of complex lighting?

Date:2026-03-27

Complex lighting conditions are a critical factor affecting the accuracy of DIC measurements. To obtain high-precision and reliable DIC measurement results, lighting control must be considered a core aspect as important as system calibration and speckle preparation. By carefully designing active uniform illumination, strictly controlling the test environment, optimizing camera settings, ensuring high-quality speckle, and supplementing with appropriate image preprocessing and the selection of robust algorithms, the challenges of light can be overcome to the greatest extent.

Overcoming the effects of light requires a comprehensive approach encompassing lighting design, environmental control, hardware selection, and software algorithms.

1. Optimize active lighting systems (preferred strategy)

Choose a suitable light source: Prioritize high-brightness, stable, and uniformly emitting LED surface or strip light sources. Avoid using light sources that flicker or generate a lot of heat (such as halogen lamps).

Homogenization: Use diffusers, softboxes, light guides, etc. to transform point/line light sources into uniform surface light sources, eliminating directional shadows and highlights.

Multi-light source layout: Multiple light sources are arranged symmetrically to illuminate the object under test from different angles, effectively filling in shadows and improving overall uniformity. Ring light sources are a commonly used choice.

Brightness control: Ensure moderate and adjustable light intensity to avoid underexposure or overexposure. Use the camera histogram or software preview function to assist in adjustment.

Light source stability assurance: Use high-quality regulated power supplies to avoid voltage fluctuations caused by sharing circuits with high-power equipment.

2. Control the test environment

Block ambient light: Conduct tests in a dark room or using a light shield/tent if possible to completely isolate external stray light interference. This is one of the most effective methods.

Stable environment: Avoid areas near switches, other light sources, or direct sunlight.

Camera settings and selection optimization:

Exposure control: Precisely set the exposure time (shutter speed) to ensure appropriate and stable image brightness. Prioritize manual exposure mode to avoid inter-frame brightness fluctuations caused by automatic exposure (AE).

Gain control: Use low gain (or ISO) whenever possible to reduce image sensor noise. In low light conditions, prioritize increasing light source brightness or exposure time rather than increasing gain.

Lens Aperture: Choose an appropriate aperture (F-number) to balance depth of field and light intake. Too small an aperture may cause diffraction and reduce resolution, while too large an aperture will result in a shallow depth of field and may introduce aberrations.

Choose a high-performance camera: Select a camera sensor with high dynamic range (HDR), high quantum efficiency, and low readout noise (such as sCMOS, high-end CMOS), which can tolerate uneven lighting or low light to a certain extent.

3. Optimize speckle quality

High contrast: Ensure sufficient grayscale difference between the speckle (dark) and the background (light). Use a light background with dark speckle when there is insufficient light or a dark background; in strong light, consider a dark background with light speckle.

Appropriate size: The speckle size should match the camera resolution and field of view. It is generally recommended that the speckle diameter be 3-5 pixels (the basis for subpixel algorithms to work).

Randomness and density: The speckle distribution should be highly random and of moderate density (covering most pixels), avoiding regular patterns or large areas of blank/clustered areas.

4. Utilizing advanced image processing and DIC algorithms

Image preprocessing:

Background subtraction/flat field correction: Capture a uniform background image without speckle and subtract it from the original speckle image. This can effectively compensate for fixed illumination inhomogeneities (vignetting) and fixed pattern noise.

Filtering and noise reduction: Before image matching calculation, use appropriate spatial filters (such as Gaussian filtering, median filtering) to reduce image noise, but care should be taken to avoid excessive blurring of speckle edges.

Algorithm Enhancement:

Robust matching criteria: Using matching functions that are relatively insensitive to changes in illumination (such as zero-mean normalized cross-correlation - ZNCC) is more resistant to uneven illumination and slow changes than traditional cross-correlation (CC) or sum of squared differences (SSD).

Research on illumination invariant algorithms: The academic community is exploring more advanced algorithms (such as models based on gradient information, phase information, or deep learning) in an attempt to reduce the impact of illumination changes directly at the algorithm level, but mature industrial applications are still some time away.

Complex lighting conditions are a key factor affecting the accuracy of DIC measurements. By carefully designing active uniform illumination, strictly controlling the test environment, optimizing camera settings, ensuring high-quality speckle patterns, and supplementing with appropriate image preprocessing and robust algorithms, the challenges of light can be overcome to a great extent. Understanding the mechanisms of lighting effects and taking effective countermeasures are crucial to ensuring that DIC technology can unleash its full potential in various demanding real-world applications. In the world of DIC, "seeing" clear and stable speckle patterns is a prerequisite for "measuring" accurate deformation.

Recommended Information

  • The microscopic DIC measurement system provides standardized testing solutions covering the entire chain—from chip design and packaging processes to reliability verification and failure analysis. It is suitable for the quantitative analysis of dynamic thermal warpage at the micron scale in advanced packaging, supporting yield improvements and technological iteration within the domestic advanced packaging industry.
    2026-07-10
  • Microscopic DIC measurement technology is employed to measure thermal warpage and deformation in chips. Thanks to key advantages—such as non-contact operation, sub-micron precision, full-dimensional data output, and stability across the entire temperature range—it has become the standardized technical approach for the quantitative inspection of thermal warpage, thermal deformation, and thermal stress. Representative equipment, such as the XTOP3D XTDIC-MICRO microscopic DIC system, comprehensively addresses inspection needs across the entire value chain, including chip R&D, packaging processes, reliability verification, and failure analysis.
    2026-07-10
  • A microscopic DIC measurement system is employed to conduct thermal deformation and warpage testing on chips subjected to full-range temperature cycling. This process fully replicates deformation dynamics across the heating, soaking, and cooling stages of reflow soldering and precisely quantifies warpage values ​​at various temperature points, enabling the optimization of mold compound formulations and reflow heating profiles to ensure high chip packaging yields.
    2026-07-10