Knowledge Sharing

XTOP3D releases the latest news and information, providing you with first-hand information about the company.
High-Speed ​​DIC Measurement System, High-Speed ​​Strain Measurement

The High-Speed ​​DIC Dynamic Measurement System Addresses the Challenge of Capturing Microsecond-Scale Strain Fields.

Date:2026-03-27

In ultra-high-speed scenarios (>10,000 fps) such as explosive impacts, ballistic penetration, and dynamic material fracture, traditional measurement methods struggle to capture transient strain fields. The high-speed DIC+ ultra-high-speed camera system can be used for dynamic strain measurement, high-speed deformation measurement, ballistic testing, and dynamic material fracture, revealing the secrets of precise measurement of microsecond-level deformation fields.

High-speed dynamic DIC measurement technology challenges

High-speed dynamic measurement faces four major technical challenges: first, motion blur and image tearing, where the target’s violent movement under microsecond-level exposure causes image blurring and loss of speckle features; second, insufficient 3D synchronization accuracy, where the frame rate difference between the two cameras and trigger delay lead to 3D reconstruction distortion; third, the bottleneck of real-time processing of massive data, where TB-level high-speed image streams far exceed the processing capabilities of traditional DIC software; and fourth, interference from complex environments, such as shock wave vibration, debris occlusion, and extreme lighting interference affecting imaging stability.

Innovative technical solution: High-speed DIC dynamic measurement

With continuous breakthroughs in technologies such as image sensors, optical lenses, and image processing, the performance of high-speed cameras has been greatly improved, including higher frame rates, higher resolutions, lower latency, and lower power consumption.

Digital image correlation (DIC) technology combined with a high-speed camera is one of the few solutions capable of acquiring structural displacement and strain information under real high-speed operating conditions. The high-speed camera acquires a continuous sequence of images in an extremely short time, while the DIC algorithm calculates speckle variations in the images to deduce the three-dimensional displacement and strain fields. This equipment combination solution primarily addresses the following three issues:

DIC Algorithm Upgrade

The highly optimized DIC algorithm employs subpixel interpolation, parallel computing, and GPU acceleration technologies to improve computational speed.

Dynamic calibration

Precise dynamic or static calibration is required before or after the experiment to determine camera parameters (intrinsic parameters, extrinsic parameters, distortion). Sometimes, a fixed reference point needs to be added during the experiment for real-time compensation.

Motion blur suppression

An adaptive motion compensation algorithm is used to improve displacement measurement accuracy (under impact load).

Real-time data processing

GPU parallel computing architecture: processing speed up to 500 frames per second (1080p resolution); deep learning-assisted speckle tracking: occluded scene recognition rate >90%.

Engineering protection design

The electromagnetic shielded enclosure resists shock wave interference, the multispectral filter eliminates the effects of explosion flashes, and the modular lens quick-release system can cope with extreme environments.

Industry Applications and Value

Military Industry and Defense: Strain Field Evolution During Projectile Penetration (Case Study: Armor-Piercing Projectile Target Plate Test)

Automotive Safety: B-pillar Deformation Pattern Analysis in Crash Tests (100,000 fps)

Energy Technology: Full-Field Strain Monitoring of Battery Thermal Runaway and Explosion

Materials Science: Measurement of Dynamic Fracture Toughness in Metals with Lamellar Cracks

 

Recommended Information

  • The microscopic DIC measurement system provides standardized testing solutions covering the entire chain—from chip design and packaging processes to reliability verification and failure analysis. It is suitable for the quantitative analysis of dynamic thermal warpage at the micron scale in advanced packaging, supporting yield improvements and technological iteration within the domestic advanced packaging industry.
    2026-07-10
  • Microscopic DIC measurement technology is employed to measure thermal warpage and deformation in chips. Thanks to key advantages—such as non-contact operation, sub-micron precision, full-dimensional data output, and stability across the entire temperature range—it has become the standardized technical approach for the quantitative inspection of thermal warpage, thermal deformation, and thermal stress. Representative equipment, such as the XTOP3D XTDIC-MICRO microscopic DIC system, comprehensively addresses inspection needs across the entire value chain, including chip R&D, packaging processes, reliability verification, and failure analysis.
    2026-07-10
  • A microscopic DIC measurement system is employed to conduct thermal deformation and warpage testing on chips subjected to full-range temperature cycling. This process fully replicates deformation dynamics across the heating, soaking, and cooling stages of reflow soldering and precisely quantifies warpage values ​​at various temperature points, enabling the optimization of mold compound formulations and reflow heating profiles to ensure high chip packaging yields.
    2026-07-10