Knowledge Sharing

XTOP3D releases the latest news and information, providing you with first-hand information about the company.
DIC Technology, Digital Image Correlation (DIC) Technology, Ultra-High Temperature Strain Measurement

DIC Technology Solves the Challenge of Ultra-High-Temperature Strain Measurement at 3000°C

Date:2026-03-27

Industry pain points and DIC technology advantages

In extreme operating environments such as rocket engines and nuclear fusion reactors, strain data of materials at ultra-high temperatures of 3000°C is a core basis for safety design. Traditional electrical measurement methods fail due to sensor melting, while digital image correlation (DIC) technology achieves three major breakthroughs through non-contact optical measurement:

Full-field strain measurement: Captures the micro-strain distribution at 10,000+ measurement points on the material surface (accuracy ±0.05%).

Anti-extreme thermal interference: High-temperature resistant optical system + thermal drift compensation algorithm, stable operation in 3000°C gas.

Dynamic process tracking: High-speed acquisition of crack initiation process under thermal shock at 1000fps.

Key technology breakthrough details

Ultra-high temperature speckle preparation technology

A yttrium-stabilized zirconia (YSZ) coating applied by plasma spraying exhibits a speckle reflectance attenuation of <5% in an oxidizing environment at 3000°C.

Nanoscale Al₂O₃-MoSi₂ composite speckle pattern, resistant to thermal shock cycles >200.

Multispectral anti-interference system

Dual narrowband filtering (808nm±5nm & 1064nm±10nm) suppresses thermal radiation noise.

Sapphire protective window (8mm thick) blocks 160kW/m² heat flux.

Thermal deformation separation algorithm

Based on real-time temperature field mapping from an infrared thermal imager, compensation is made for apparent strain errors caused by thermal expansion.

Strain measurement uncertainty < 50 με (@1500°C)

Empirical evidence of cutting-edge applications

Solid rocket motor throat liner material: DIC technology can be used to monitor the anisotropic strain of C/C composite materials at 2900°C.

Nuclear fusion device divertor target plate: Digital speckle (DIC) technology can track the thermal fatigue crack propagation rate of tungsten-copper gradient materials.

Hypersonic vehicle thermal protection system: Digital speckle (DIC) technology can quantify the warping deformation of ceramic matrix composites under Mach 7 aerodynamic heating.

 

Recommended Information

  • The microscopic DIC measurement system provides standardized testing solutions covering the entire chain—from chip design and packaging processes to reliability verification and failure analysis. It is suitable for the quantitative analysis of dynamic thermal warpage at the micron scale in advanced packaging, supporting yield improvements and technological iteration within the domestic advanced packaging industry.
    2026-07-10
  • Microscopic DIC measurement technology is employed to measure thermal warpage and deformation in chips. Thanks to key advantages—such as non-contact operation, sub-micron precision, full-dimensional data output, and stability across the entire temperature range—it has become the standardized technical approach for the quantitative inspection of thermal warpage, thermal deformation, and thermal stress. Representative equipment, such as the XTOP3D XTDIC-MICRO microscopic DIC system, comprehensively addresses inspection needs across the entire value chain, including chip R&D, packaging processes, reliability verification, and failure analysis.
    2026-07-10
  • A microscopic DIC measurement system is employed to conduct thermal deformation and warpage testing on chips subjected to full-range temperature cycling. This process fully replicates deformation dynamics across the heating, soaking, and cooling stages of reflow soldering and precisely quantifies warpage values ​​at various temperature points, enabling the optimization of mold compound formulations and reflow heating profiles to ensure high chip packaging yields.
    2026-07-10