The XTOP3D XTDIC 3D full-field strain measurement system utilizes DIC technology suitable for measurements in diverse environments—including high/low temperatures, underwater settings, reflective surfaces, and vacuums. By precisely determining the cameras' intrinsic and extrinsic matrices as well as deformation parameters, the system corrects for medium-induced distortion, thereby enabling accurate Digital Image Correlation (DIC) measurements.

XTOP3D’s Digital Image Correlation (DIC) technology accurately measures the transient 3D displacement of automotive components under wind tunnel loading conditions. It analyzes the dynamic deformation of parts—such as doors, pillars, and hoods—subjected to aerodynamic forces. The visualized measurement results facilitate the optimization of vehicle body stiffness, the design of aerodynamic kits, and the enhancement of NVH performance.

The XTOP3D XTDIC-MICRO 3D microscopic strain measurement system utilizes microscopic DIC technology to measure the deformation of miniature electronic components under high and low-temperature conditions (25°C–300°C). By analyzing regions of strain concentration and maximum strain data, the system helps prevent failures caused by issues such as mismatched thermal expansion/contraction properties, mismatches in the temperature coefficients of internal leads and die coatings, and chip cracking.

The XTOP3D XTDIC 3D full-field strain measurement system utilizes Digital Image Correlation (DIC) technology to monitor deformation in lattice-anchor models designed for landslide control. Such simulation experiments facilitate a deeper understanding of landslide formation mechanisms, evolutionary processes, and failure modes; they reveal the mechanical responses and deformation patterns of geological bodies under various influencing factors, thereby providing a scientific basis for optimizing reinforcement designs.

新拓三维XTDIC三维全场应变测量系统，可配合温度试验箱组成热变形翘曲测量系统，对晶圆等微电子器件进行受热变形条件下的平整度、共面性测量，也可用于表面应变分布测量和热膨胀系数（CTE）测试，提前预测晶圆热变形趋势，有助于半导体材料研究及保证制造质量。

新拓三维显微dic应变测量系统，应用于面条等柔性、细长结构弯折变形与应变测量，具有高分辨率、高放大倍数和数据全面性等优势，可揭示面条微观尺度下的力学行为，它解决了传统方法的精度和微小尺寸适用性瓶颈，为食品科学、材料工程等领域提供强大的分析工具。

新拓三维显微dic应变测量系统，应用于面条等柔性、细长结构弯折变形与应变测量，具有高分辨率、高放大倍数和数据全面性等优势，可揭示面条微观尺度下的力学行为，它解决了传统方法的精度和微小尺寸适用性瓶颈，为食品科学、材料工程等领域提供强大的分析工具。

新拓三维XTDIC三维全场应变测量系统，非接触式、动态跟踪沙土边坡模型表面运动，数字图像相关DIC技术分析边坡模型位移场与应变场，通过变形场演化分析典型的“滑移式”破坏模式，为滑坡治理工程优化、支护结构的设计提供定量依据。

多套XTDIC三维应变测量系统，常规DIC测量系统与显微DIC系统，配合小型实验机、多路温度测量仪，定制防爆防护罩， 分析造型粉颗粒（炸药粉尘）在分布压装过程中的位移场、应变场计算结果。DIC测量系统实时观测压装过程中温度变化结果，实现对炸药分步压装工艺适应性及安全性的影响，以实时分析其流动速度、堆积密度等参数，为分步压装工艺要求提供评判依据。

The XTOP3D XTDIC 3D full-field strain measurement system is widely used in deformation and damage testing of thin-film composite materials such as composite braids, composite hollow structure sandwich models, 3D-printed composite structures, and thick-line braids. It has significant advantages in measuring the deformation behavior of composite materials.

The DIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC), is a method that calculates the displacement field and strain field based on the changes in speckle on the specimen surface. It is suitable for evaluating the mechanical properties of materials under various environmental conditions and analyzing their mechanical performance parameters such as strength, stiffness, plasticity, elasticity, and ductility.

The XTOP3D XTDIC three-dimensional full-field strain measurement system, based on digital image correlation (DIC) technology, can simultaneously measure the morphology, deformation, and strain of materials in high-temperature environments. It can detect surface shape changes caused by high temperatures, reveal the material failure process, and quantitatively determine the critical temperature and strain range for failure.

The XTOP3D XTDIC 3D full-field strain measurement system overcomes image distortion and noise interference under extreme conditions, solving DIC measurement challenges in these conditions and enabling applications in typical extreme conditions such as high temperature, through glass, multi-scale, and underwater.

The XTDIC 3D full-field strain measurement system performs torsional fatigue testing on welded specimens. By monitoring full-field dynamic strain, fatigue damage and crack development in the weld area under torsional loading are analyzed, further enabling analysis of the specimen's fatigue characteristics. Its advantages lie in its non-contact nature, high temporal and spatial resolution, and the potential for coupled multi-physics analysis.

The XTDIC three-dimensional digital speckle full-field strain measurement system is used to analyze the strain concentration area and strain magnitude during the bending process of the mobile phone screen, and the displacement changes during the opening and closing process of the foldable phone are analyzed, providing measurement data basis for mobile phone manufacturers to optimize their products in the future.

Using the XTOP3D XTDIC three-dimensional full-field strain measurement system and the high-precision, high-sensitivity full-field non-contact optical measurement characteristics of the digital speckle correlation method (3D-DIC), and using a high-speed camera to capture speckle images, wind tunnel tests were carried out on the blades under different aerodynamic loads and centrifugal loads.

The axle loading test adopts a 1-40 ton load control method and uses 3D-DIC technology for full-field displacement and strain measurement. During the deformation process of the axle, a sequence of images is captured in real time, and data analysis is performed using DIC software to obtain its full-field displacement and strain.

To measure the swing displacement of the crane boom, the XTOP3D XTDIC three-dimensional full-field strain measurement system collects data in real time. Based on the displacement changes of the marked coding points, the swing displacement of the boom in the direction perpendicular to the boom plane is measured.