Applications

Applications cover aerospace, automotive manufacturing, electronics manufacturing, energy and heavy industry, biomedicine, geotechnical engineering, materials testing and other industries.
Photographic Industrial blue light 3D scanner, high-precision 3D scanner, 3d full-field strain measurement, non-contact strain measurement, digital image correlation method (DIC technology), video extensometer, 3D bent tube inspection system
  • DIC measurement, digital image correlation, 3D strain measurement, automotive reliability testing, structural deformation, vehicle safety testing, XTDIC system, XTOP3D
    The XTOP3D DIC 3D strain measurement system is driving the transformation of reliability assessment in intelligent automotive manufacturing from "point-based measurement" to "full-field, data-driven analysis." From capturing the critical moment of rupture within milliseconds during power battery crush tests to identifying micron-level strain gradients in aluminum alloy wheels, DIC technology leverages non-contact, high-resolution full-field measurement capabilities to precisely quantify every deformation—turning reliability from a matter of probability into a traceable engineering metric.
    2026-05-12
  • DIC technology, Digital Image Correlation, seismic testing, precast frame joints, prefabricated structural joints.earthquake damage analysis, structural deformation measurement, 3D full-field strain measurement, concrete node testing.
    Digital Image Correlation (DIC) technology is applied to seismic performance tests of prefabricated concrete-filled steel tubular (CFST) beam-column joints. This paper introduces typical applications of XTOP3D DIC technology, including strain field analysis in the joint core region, tracking of crack initiation and propagation, and identification of failure modes. The study demonstrates that DIC technology effectively overcomes the limitations of traditional contact-based measurement methods, providing experimental data to support the analysis of mechanical behavior and design optimization for prefabricated joints.
    2026-04-10
  • DIC strain measurement, Digital Image Correlation, 3D full-field strain, non-contact measurement. concrete compression test, concrete failure analysis, concrete crack monitoring, uniaxial compression, reinforced concrete testing. XTDIC system, 3D DIC
    The XTDIC 3D full-field strain measurement system effectively addresses the challenge of directly quantifying the mechanical behavior of reinforcing bars. Utilizing a binocular or multi-camera DIC setup, the system performs full-field monitoring of concrete cylindrical specimens under static compressive loads. It enables non-contact acquisition of 3D displacement and strain field distributions, captures the processes of surface crack initiation, propagation, and strain concentration evolution in real-time, and accurately back-calculates the cooperative deformation mechanism between the steel and concrete, thereby providing high-precision experimental data for structural design and failure mechanism analysis.
    2026-04-10
  • Digital Image Correlation, DIC technology, stress-strain testing, 3D full-field strain measurement, material testing, structural deformation, XTDIC system, optical measurement
    The XTOP3D XTDIC 3D full-field strain measurement system leverages non-contact DIC technology to precisely capture 3D displacement and strain across the entire field. It dynamically reconstructs mechanical behavior without physical contact and is adaptable to complex surfaces and extreme environments. By providing comprehensive data support for engineering safety, product R&D, and material testing, it unlocks a new dimension in stress-strain analysis.
    2026-03-26
  • 3D DIC technology / DIC system,Digital Image Correlation,Composite material testing,Full-field strain measurement,Composite damage monitoring,Non-contact strain measurement,CFRP strain analysis,XTDIC 3D system
    Leveraging advantages such as high resolution and full-scale adaptability—and validated against both laboratory and engineering standards—DIC technology enables the precise detection of micro-strains and early-stage damage. Widely applied across various composite materials, it integrates with technologies like AI and digital twins to achieve breakthroughs ranging from mechanical performance verification to monitoring in extreme environments, thereby driving the evolution of composite material monitoring toward greater intelligence, efficiency, and precision.
    2026-03-26
  • DIC technology, digital image correlation, concrete three-point bending test, fracture evolution analysis, 3D full-field strain measurement, crack propagation, XTDIC system, material mechanics testing, XTOP3D
    Based on non-contact deformation measurement technology, the XTDIC 3D full-field deformation measurement system is precisely applied to concrete three-point bending tests. It enables the visualization of crack initiation and propagation, dynamic reconstruction of strain fields, and quantitative analysis of fracture parameters, thereby providing accurate technical support for evaluating material flexural strength and fracture toughness, and driving upgrades in material testing and engineering inspection.
    2026-03-26
  • digital image correlation, DIC technology, 3D strain measurement, compression deformation, single-camera DIC, telecentric lens DIC, micro-strain measurement, XTDIC
    The XTOP3D XTDIC 3D full-field strain measurement system combines Digital Image Correlation (DIC) technology with telecentric lenses to achieve sub-micron precision, making it ideally suited for complex, miniature specimens such as those with micropores or curved surfaces. Capable of performing full-field deformation testing with a single camera, the system offers simple calibration and cost-effective operation; it accurately captures minute compressive deformations in soft and micro-scale structures, providing stable, reliable full-field data for mechanical property testing of lightweight chemical materials.
    2026-03-26
  • DIC technology, digital image correlation, 3D strain measurement, concrete crack analysis, crack propagation, four-point bending test, full-field strain, XTOP3D
    The XTOP3D XTDIC 3D full-field strain measurement system is used to quantitatively characterize the cracking behavior of concrete panels under four-point bending loads and the mechanical response of sandwich structures. DIC technology enables the analysis of crack initiation and propagation on the panel sides, providing data to support the crack-resistance design of concrete sandwich panels and the validation of numerical models.
    2026-03-26
  • Digital Image Correlation, DIC technology, lithium battery expansion, battery bulging, 3D strain measurement.non-contact deformation measurement, lithium-ion battery strain analysis, full-field 3D displacement, battery safety testing equipment.
    The XTOP3D XTDIC 3D full-field strain measurement system utilizes Digital Image Correlation (DIC) technology to monitor micro-deformations in battery casings under conditions such as charge-discharge cycling and temperature fluctuations. It also enables precise measurement of 3D deformation and strain distribution in battery electrodes, separators, and even entire battery packs during charging and discharging, providing critical data for evaluating battery safety and structural stability.
    2026-03-26
  • DIC technology, 3D deformation measurement, structural beam bending, full-field strain analysis, Digital Image Correlation, mechanical testing, XTOP3D DIC system
    The XTOP3D XTDIC 3D full-field strain measurement system is utilized to measure the bending deformation of structural beams. By employing DIC technology, the system captures displacement and strain fields under bending loads, performs full-field deflection analysis, and generates displacement/strain curves for specific points of interest. This enables the visualization and measurement of transverse bending deformation characteristics, providing reliable experimental data to support research into the mechanical properties of engineering structures.
    2026-03-26
  • 3D printing deformation measurement, additive manufacturing testing, DIC technology, 3D strain measurement system, structural deformation analysis, XTDIC system, digital image correlation, XTOP3D
    The XTOP3D XTDIC 3D full-field strain measurement system utilizes Digital Image Correlation (DIC) technology to analyze the complex mechanical behavior of 3D-printed metal structural components. Offering the advantages of full-field deformation measurement and analysis, it provides experimental data to support lightweight structural design, process parameter optimization, and performance evaluation of welded structures. The system guides the refinement of welding processes and structural optimization parameters, serving as a data basis for the design and reliability verification of 3D-printed metal structures.
    2026-03-26
  • DIC technology,Digital Image Correlation,Railway track deformation,3D dynamic measurement,Rail displacement monitoring,Railway fastener deformation,Train cornering dynamic load,3D DIC measurement system
    The XTOP3D XTDIC-STROBE 3D dynamic measurement system utilizes high-speed, high-resolution digital cameras and DIC technology to analyze the dynamic deformation and displacement of rails and fastening systems as trains negotiate curves at high speeds. It identifies design weaknesses—such as points of stress concentration—and validates the effectiveness of new fasteners, sleepers, and ballast structures in controlling deformation.
    2026-03-26
  • DIC technology, welding deformation measurement, Digital Image Correlation,sheet metal welding process optimization, high-temperature deformation monitoring, full-field strain measurement system, 3D DIC system
    The XTOP3D DIC high-temperature metal welding deformation measurement solution utilizes Digital Image Correlation (DIC) technology. By overcoming issues such as thermal radiation, heat flow disturbances, and speckle pattern degradation—which typically cause image "decorrelation" at high temperatures—the system successfully measures deformation during high-temperature welding. It analyzes stress variation patterns in welded components, thereby ensuring product quality during manufacturing and processing.
    2026-03-26
  • Flexible PCB deformation measurement,3D DIC technology, Full-field strain measurement,FPC bending test,Digital image correlation system,Flexible material mechanics,Non-contact strain measurement,XTDIC system
    The XTOP3D DIC 3D strain measurement system empowers bending tests for flexible materials. Utilizing non-contact DIC technology, it achieves high-precision, full-field displacement and strain measurement, captures localized strain concentrations, and quantifies data throughout the bending and recovery process. This provides visual data support for FPC structural optimization, failure prediction, and reliability verification, thereby facilitating the high-quality development of flexible electronics.
    2026-03-26
  • DIC technology,Strain and crack analysis,Railway box girder,3D strain measurement,Digital image correlation in civil engineering,Four-point bending test of concrete bridge,Full-field strain measurement system,Structural deformation, load testing, cra
    The XTOP3D XTDIC 3D full-field strain measurement system, based on Digital Image Correlation (DIC) technology, was employed for four-point bending tests on decommissioned railway bridge box girders. It enabled dynamic monitoring of full-field strain distribution and the entire process of crack initiation and propagation during loading. The test results revealed the structural damage evolution patterns of the box girders and provided a scientific data basis for the service life assessment, maintenance strategy formulation, and safe operation decision-making of railway infrastructure.
    2026-03-26
  • DIC technology, concrete deformation monitoring, 3D strain measurement,XTDIC system, full-field strain measurement, concrete pouring vibration, digital image correlation,civil engineering strain measurement, dynamic wall vibration tracking
    The XTOP3D XTDIC 3D full-field strain measurement system utilizes Digital Image Correlation (DIC) technology to monitor wall deformation during the casting of novel architectural concrete. It tracks deformations caused by fluid impact during pouring, high-frequency dynamic deformations during vibration-based compaction, and micro-deformations during the setting and hardening phases, thereby providing data support to optimize architectural design, ensure construction safety, and enhance engineering quality.
    2026-03-26
  • 3D DIC system, digital image correlation, XTDIC, full-field strain measurement, non-contact strain measurement,concrete crack propagation analysis, concrete beam 3-point bending test, civil engineering deformation tracking, multi-camera DIC
    The XTOP3D XTDIC 3D full-field strain measurement system utilizes DIC technology to perform fully automated, high-precision, full-field crack measurement during three-point bending tests on concrete beams. By employing correlation algorithms to calculate specimen strain and applying digital image processing techniques to detect crack characteristics—such as size, length, and orientation—the system provides a comprehensive, reliable, and accurate solution for crack measurement in concrete loading experiments.
    2026-03-26
  • Digital Image Correlation (DIC), Composite material deformation, 3D full-field strain measurement, FRP tensile testing DIC, High-temperature composite testing, Non-contact strain measurement, DIC damage characterization
    The XTOP3D XTDIC 3D full-field strain measurement system is based on Digital Image Correlation (DIC) technology. It is suitable for high-precision, full-field strain measurement on the surfaces of various composite materials. The system enables the accurate identification of points of maximum deformation and the observation of crack initiation, propagation, and coalescence. By providing an intuitive analysis of failure processes, it offers essential data support for the performance evaluation and design optimization of composite materials.
    2026-03-26
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