XTOP3D Empowers Smart Manufacturing with 3D Optical and DIC Measurement at ITES Shenzhen

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• XTOP 3D Showcases XTDIC Strain Measurement System at China Materials Conference 2026

  At the China Materials Conference 2026 in Wuhan, XTOP 3D showcased its self-developed XTDIC series of 3D full-field strain measurement products. Addressing the limitations of traditional single-point mechanical testing, the non-contact optical DIC solutions provide high-precision, non-destructive evaluation across diverse conditions—including quasi-static, high-temperature coupling, cyclic fatigue, and high-speed impact—to accelerate new material R&D and reliability verification.

  2026-07-17
• XTOP3D Showcases 3D DIC Strain Measurement at CESB 2026 for Biomaterials Innovation

  XTOP3D made a significant appearance at the China-Europe Symposium on Biomaterials (CESB 2026), showcasing its XTDIC 3D full-field strain measurement system and XTOM high-precision 3D scanner to empower innovation in biomaterials and medical devices. Leveraging a portfolio of 3D optical measurement solutions, the company supports a wide range of applications—including mechanical property testing for biomaterials, digital dentistry, high-precision dimensional inspection of implants, and comprehensive testing for deformation, posture, and fatigue—thereby safeguarding product quality across the industry through professional technology.

  2026-07-10
• Exploring Micro-Forces: XTOP3D Highlights Micro-DIC 3D Strain Measurement at the 3rd Micro-Mechanical Testing Seminar

  XTOP3D participated in the 3rd Symposium on Mechanical Testing Methods and Technologies for Micro-specimens, showcasing its 3D microscopic strain measurement system and demonstrating its applications in areas such as mechanical property testing of materials at the mesoscale, as well as thermal (warpage and CTE measurement) and mechanical deformation analysis of semiconductor devices.

  2026-03-25
• Advancing Material Research: XTOP3D Showcases 3D Full-Field Strain Measurement Solutions at CIAMITE

  XTOP3D showcased its XTDIC 3D full-field strain measurement system at the China Materials Conference 2025, demonstrating the system's application in mechanical testing for new material R&D. The system supports a wide range of tests—including tension, compression, bending, torsion, and shear—and accommodates static, quasi-static, and dynamic strain, vibration, and high-speed deformation measurements, as well as testing in extreme high- and low-temperature environments. It also features connectivity modules for various testing machines to meet diverse experimental requirements.

  2026-03-25
• XTOP3D Showcases DIC 3D Strain Measurement System at CCTAM 2025 to Advance Material Mechanics Research

  XTOP3D has been invited to exhibit at the Chinese Congress of Theoretical and Applied Mechanics 2025, where it will showcase the XTDIC 3D full-field strain measurement system and its applications in areas such as static load testing, dynamic fatigue testing, and 3D deformation and strain measurement. DIC technology provides researchers with reliable experimental data for studying the mechanical properties of various materials and structures.

  2026-03-25
• High-Speed DIC Technology: Capturing Transient Deformation in Explosion Mechanics

  This article highlights the application of XTOP3D’s XTDIC-SPARK 3D high-speed measurement system in explosion mechanics and high-strain-rate impact testing. It focuses on three typical application scenarios: Analysis of transient deformation and displacement curves during high-speed armor-piercing projectile impact; Full-field strain monitoring with high spatiotemporal resolution during Hopkinson Bar impact tests; Quantitative analysis of transient crack evolution and propagation behavior in materials during high-speed compression tests. Key technical breakthroughs include achieving sub-pixel measurement accuracy under conditions of ultra-high speeds, short time windows, and severe deformation, as well as overcoming challenges related to the acquisition of specialized speckle patterns.

  2026-03-25