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Seizing GBA Opportunities: XTOP3D Emerges as a Pioneer in 3D Optical Metrology

Date:2025-03-20

[Guided by Xi Jinping Thought on Socialism with Chinese Characteristics for a New Era — New Era, New Actions, New Chapters] Guangdong-Hong Kong-Macao Greater Bay Area: Striving to Build an Engine for Sci-Tech Innovation.



The development of the Guangdong-Hong Kong-Macao Greater Bay Area is a major national strategy personally planned, deployed, and driven by General Secretary Xi Jinping, and a significant measure to foster a new landscape of comprehensive opening-up in the new era. Establishing an international center for science and technology innovation stands as the top priority in the development of the Greater Bay Area.

XTOM-MATRIX Blue-Light 3D Scanner (Multi-axis) Featured on *Xinwen Lianbo*



XTOP3D boldly seizes opportunities to establish itself as a pioneer in scientific and technological innovation within the Guangdong-Hong Kong-Macao Greater Bay Area. 


In a ten-minute headline report on CCTV’s *News Simulcast* regarding the national plan for the Greater Bay Area, Orbbec—a "unicorn" enterprise in the smart hardware sector—was the only company featured. As an industrial subsidiary of Orbbec, XTOP3D will fully leverage the regional and talent advantages of the Greater Bay Area, striding confidently toward its goal of becoming a globally influential provider of 3D industrial inspection solutions.




XTOP3D is dedicated to research in advanced 3D optical measurement technology, the development of measurement equipment series, and the provision of technical solutions. Headquartered in Shenzhen, the company operates R&D centers in Xi'an and Michigan (USA), with additional offices in Xi'an, Beijing, Shanghai, and Shenzhen. Its core team originated from the 3D technology group at Xi'an Jiaotong University, boasting a long-standing commitment to both fundamental and applied research in 3D optical measurement. The team formulated the first national standard in the field of 3D optical measurement; their projects have garnered a Second Prize in the National Technological Invention Award and a First Prize in the Shaanxi Province Science and Technology Award, with numerous research achievements and key technologies reaching an internationally advanced level.

Mature Products Filling Multiple Domestic Technological Gaps

The company offers a range of mature 3D optical measurement and inspection products; several of these have filled domestic gaps, establishing the company as the sole domestic supplier. Its product portfolio—spanning 3D profile inspection, 3D strain and deformation measurement, 3D dynamic and motion trajectory analysis, and scientific research instruments—is widely utilized by research institutions, universities, and enterprises both at home and abroad. These products support research, production, and in-line inspection across industries such as consumer electronics, automotive, heavy machinery, and healthcare, as well as in more than ten academic disciplines, including mechanical engineering, materials science, mechanics, and civil engineering.


Recommended Information

  • At the China Materials Conference 2026 in Wuhan, XTOP 3D showcased its self-developed XTDIC series of 3D full-field strain measurement products. Addressing the limitations of traditional single-point mechanical testing, the non-contact optical DIC solutions provide high-precision, non-destructive evaluation across diverse conditions—including quasi-static, high-temperature coupling, cyclic fatigue, and high-speed impact—to accelerate new material R&D and reliability verification.
    2026-07-17
  • XTOP3D made a significant appearance at the China-Europe Symposium on Biomaterials (CESB 2026), showcasing its XTDIC 3D full-field strain measurement system and XTOM high-precision 3D scanner to empower innovation in biomaterials and medical devices. Leveraging a portfolio of 3D optical measurement solutions, the company supports a wide range of applications—including mechanical property testing for biomaterials, digital dentistry, high-precision dimensional inspection of implants, and comprehensive testing for deformation, posture, and fatigue—thereby safeguarding product quality across the industry through professional technology.
    2026-07-10
  • XTOP3D participated in the 3rd Symposium on Mechanical Testing Methods and Technologies for Micro-specimens, showcasing its 3D microscopic strain measurement system and demonstrating its applications in areas such as mechanical property testing of materials at the mesoscale, as well as thermal (warpage and CTE measurement) and mechanical deformation analysis of semiconductor devices.
    2026-03-25
  • XTOP3D showcased its XTDIC 3D full-field strain measurement system at the China Materials Conference 2025, demonstrating the system's application in mechanical testing for new material R&D. The system supports a wide range of tests—including tension, compression, bending, torsion, and shear—and accommodates static, quasi-static, and dynamic strain, vibration, and high-speed deformation measurements, as well as testing in extreme high- and low-temperature environments. It also features connectivity modules for various testing machines to meet diverse experimental requirements.
    2026-03-25
  • XTOP3D has been invited to exhibit at the Chinese Congress of Theoretical and Applied Mechanics 2025, where it will showcase the XTDIC 3D full-field strain measurement system and its applications in areas such as static load testing, dynamic fatigue testing, and 3D deformation and strain measurement. DIC technology provides researchers with reliable experimental data for studying the mechanical properties of various materials and structures.
    2026-03-25
  • This article highlights the application of XTOP3D’s XTDIC-SPARK 3D high-speed measurement system in explosion mechanics and high-strain-rate impact testing. It focuses on three typical application scenarios: Analysis of transient deformation and displacement curves during high-speed armor-piercing projectile impact; Full-field strain monitoring with high spatiotemporal resolution during Hopkinson Bar impact tests; Quantitative analysis of transient crack evolution and propagation behavior in materials during high-speed compression tests. Key technical breakthroughs include achieving sub-pixel measurement accuracy under conditions of ultra-high speeds, short time windows, and severe deformation, as well as overcoming challenges related to the acquisition of specialized speckle patterns.
    2026-03-25