Non-contact strain measurement system—application advantages: (1) Non-contact, full-field strain measurement; (2) Direct measurement of full-field strain, displacement, deformation, and surface topography; (3) Image data output by the system's analysis software can be re-analyzed and processed to serve various research objectives without the need for repeat testing, thereby saving both cost and time.

XTOP3D’s 3D digitization solution for helmet manufacturing enables the efficient acquisition of 3D helmet data, facilitating direct design modifications to molded helmets and overcoming challenges associated with rapid design and 3D model generation. Unconstrained by shape or structure, the solution allows for the rapid creation of complex forms without the need for molds; this enhances detail precision and results in products with superior fit and comfort, helping manufacturers capture significant market opportunities.

In recent years, sales of new energy vehicles (NEVs) have surged; my country’s NEV sales reached 1.206 million units in 2019, reflecting a compound annual growth rate of 102.3%. This rapid expansion has created development opportunities for domestic manufacturers of core components—ranging from precision molds and high-end precision stamped parts to safety modules, seat and door-lock modules, and electronic control and motor modules—positioning China’s NEV supply chain to potentially lead the global market. The increasing electrification of vehicles has driven a rising demand for the R&D, design, and production of innovative precision components. 3D scanners facilitate the dimensional inspection of NEV components, thereby supporting the research and development of new energy vehicles.

As a prime example of contact-based measurement equipment, the Coordinate Measuring Machine (CMM) offers distinct advantages, such as high precision—capable of reaching the micrometer level—and the ability to directly measure specific component dimensions. However, because CMMs rely on point-by-point scanning, measurement speeds are slow; furthermore, accuracy suffers significantly when measuring components with free-form surfaces or complex contours, as fewer data points are captured. Additionally, the measurement process involves a rigid probe traversing the object's surface, making it suitable only for workpieces with hard surfaces.

Mechanical property testing of materials is a widely used procedure in engineering; it provides reliable data on mechanical properties for sectors such as mechanical manufacturing, civil engineering, and metallurgy, thereby facilitating the rational use of materials and ensuring the safe operation of machines (structures) and their components.

The 11th National Academic Symposium on Earthquake Disaster Mitigation Engineering was held in Zhengzhou, Henan, from April 22 to 24. Hosted by Zhengzhou University and organized by the Committee for the Promotion of Earthquake Disaster Mitigation Engineering Technology under the China Civil Engineering Society—with guidance from the Society itself and the Division of Civil, Hydraulic, and Architectural Engineering of the Chinese Academy of Engineering—the event brought together hundreds of experts, scholars, and engineering professionals from across the country engaged in research, teaching, design, and construction within the field of earthquake disaster mitigation engineering.

With the rapid advancement of technologies such as smartphones, 5G, and the Internet of Things (IoT), the heat dissipation power of chips has risen sharply. Concurrently, the demand for ultra-thin device profiles severely limits the space available for thermal management, making chip temperature control extremely challenging. Thermal stress can easily cause wafer warpage in CSP chips, potentially leading to cracking in severe cases. The XTOP3D XTDIC strain measurement and analysis system serves as a vital tool for analyzing chip deformation across varying temperatures; it is particularly well-suited for investigating thermal stress and stress concentration under load, thereby enabling a more comprehensive assessment of chip reliability and stability during operation.

From March 25 to 27, the 2021 13th China (Changchun) Advanced Equipment Manufacturing Expo kicked off at the Changchun International Convention and Exhibition Center.

The automotive industry is a modern sector characterized by high capital, technology, and labor intensity. After more than a century of development, automobile manufacturing has evolved into a vast industrial chain; it stands as one of the world's most significant industries—ranking among the largest in scale and highest in output value—and accounts for a substantial share of global manufacturing.

On May 10, Li Xiao'an, Vice Chairman of the Liaoning Provincial Committee of the Chinese People's Political Consultative Conference (CPPCC), led a delegation to the Xi'an Research Institute of Orbbec Inc. The delegation conducted an in-depth inspection of the XTOP3D Xi'an R&D Center and toured the XTOP3D optical measurement and testing laboratory. Dr. Tang Zhengzong, head of the Orbbec Xi'an Research Institute and CEO of XTOP3D, received the delegation.